Results 201 to 210 of about 592,843 (298)

Impact of Structural Adhesive Hybridization Strategy on the Performance of In‐Mold Electronics Devices Across Thermoforming and Injection Molding

open access: yesAdvanced Engineering Materials, EarlyView.
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García   +3 more
wiley   +1 more source

THE EFFECT OF COOLING ON WOUND HEALING

open access: green, 1944
Alfred M. Large, PETER HELNBECKER
openalex   +2 more sources

Surface Modification of Fluorine‐Free Superhydrophobic Materials with (Ultra‐)Thin TiO2 Layers

open access: yesAdvanced Engineering Materials, EarlyView.
Significant changes in wettability, with a reduction of 60o in the water conduct angle, are reported via the surface modification of fluorine‐free superhydrophobic thin films, prepared by aerosol‐assisted chemical vapor deposition, after coating a 4 nm layer of titanium dioxide on the surface using atomic layer deposition.
Julie Jalila Kalmoni   +2 more
wiley   +1 more source

Ultrasonic Atomization Spray Coating of PCL on an Mg‐Based Alloy Enhanced by Plasma Electrolytic Oxidation for Improved Adhesion, Corrosion Resistance, and Biocompatibility

open access: yesAdvanced Engineering Materials, EarlyView.
Plasma electrolytic oxidation is combined with ultrasonic spray deposition of polycaprolactone (PCL) on WE43 magnesium alloy to improve adhesion, corrosion resistance, and cytocompatibility. The hybrid coating demonstrates significantly reduced hydrogen evolution and enhances mechanical bonding, offering a promising strategy for next‐generation ...
Seyed Masih Mousavizadeh   +9 more
wiley   +1 more source

Miniaturized Mg<sub>3</sub>Bi<sub>2</sub>-based thermoelectric cooler for localized electronic thermal management. [PDF]

open access: yesNat Commun
Lin C   +20 more
europepmc   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

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