Results 201 to 210 of about 592,843 (298)
Fire performance and spalling mitigation in high-strength and eps-modified mortars under transient thermal exposure. [PDF]
Ali AYF+4 more
europepmc +1 more source
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García+3 more
wiley +1 more source
THE EFFECT OF COOLING ON WOUND HEALING
Alfred M. Large, PETER HELNBECKER
openalex +2 more sources
Surface Modification of Fluorine‐Free Superhydrophobic Materials with (Ultra‐)Thin TiO2 Layers
Significant changes in wettability, with a reduction of 60o in the water conduct angle, are reported via the surface modification of fluorine‐free superhydrophobic thin films, prepared by aerosol‐assisted chemical vapor deposition, after coating a 4 nm layer of titanium dioxide on the surface using atomic layer deposition.
Julie Jalila Kalmoni+2 more
wiley +1 more source
Deposition-Induced Thermo-Mechanical Strain Behaviour of Magnetite-Filled PLA Filament in Fused Filament Fabrication Under Varying Printing Conditions. [PDF]
Mecheri B, Guessasma S.
europepmc +1 more source
On the cooling and evaporative powers of the atmosphere, as determined by the kata-thermometer
Leonard Hill, D. Hargood-Ash
openalex +1 more source
Plasma electrolytic oxidation is combined with ultrasonic spray deposition of polycaprolactone (PCL) on WE43 magnesium alloy to improve adhesion, corrosion resistance, and cytocompatibility. The hybrid coating demonstrates significantly reduced hydrogen evolution and enhances mechanical bonding, offering a promising strategy for next‐generation ...
Seyed Masih Mousavizadeh+9 more
wiley +1 more source
Miniaturized Mg<sub>3</sub>Bi<sub>2</sub>-based thermoelectric cooler for localized electronic thermal management. [PDF]
Lin C+20 more
europepmc +1 more source
Relationship Between Rate of Cooling, Holding Container and Egg Albumen Quality
L.E. Dawson, Charlotte Hall
openalex +1 more source
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke+3 more
wiley +1 more source