Results 181 to 190 of about 10,613 (236)
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Advanced Materials Research, 2014
Fe-20wt%Cu-Al braking materials were prepared by induction heating sintering method combined with the Copper cladding iron matrix with various aluminum elements. Effects of Aluminum on surface morphology, Mechanical and frictional properties of Cu-Fe-based Braking Material were analyzed by Scanning Electron Microscope (SEM), machine test and friction ...
Zhou Wang, Chuan Qi Fu, Ping Yang
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Fe-20wt%Cu-Al braking materials were prepared by induction heating sintering method combined with the Copper cladding iron matrix with various aluminum elements. Effects of Aluminum on surface morphology, Mechanical and frictional properties of Cu-Fe-based Braking Material were analyzed by Scanning Electron Microscope (SEM), machine test and friction ...
Zhou Wang, Chuan Qi Fu, Ping Yang
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Energy and Buildings, 2015
Abstract This paper describes experimental investigation of copper-clad aluminum (CCA) tubing as a replacement for copper tubing to connect the indoor and outdoor units of split air conditioners. Experiments conducted on three specifications of CCA tubes ( φ 6.35 × 0.6 mm 2 , φ 9.52 × 0.7 mm 2 , and φ 12.7 × 0.8 mm 2 ) indicate good performance in ...
Binbin Yang +5 more
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Abstract This paper describes experimental investigation of copper-clad aluminum (CCA) tubing as a replacement for copper tubing to connect the indoor and outdoor units of split air conditioners. Experiments conducted on three specifications of CCA tubes ( φ 6.35 × 0.6 mm 2 , φ 9.52 × 0.7 mm 2 , and φ 12.7 × 0.8 mm 2 ) indicate good performance in ...
Binbin Yang +5 more
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Materials Science and Engineering: A, 2018
This work focuses on the role of the microstructure on the creep behavior of thin copper-clad aluminum (CCA) wires. Creep tests were performed at 150 degrees C on hard drawn and annealed CCA and on pure metals. It is shown that the Cu-Al interface of CCA ensures a mechanical resistance leading to lower creep velocities than for metals. Creep mechanisms
Gueydan, Antoine, Hug, Eric
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This work focuses on the role of the microstructure on the creep behavior of thin copper-clad aluminum (CCA) wires. Creep tests were performed at 150 degrees C on hard drawn and annealed CCA and on pure metals. It is shown that the Cu-Al interface of CCA ensures a mechanical resistance leading to lower creep velocities than for metals. Creep mechanisms
Gueydan, Antoine, Hug, Eric
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Advanced Materials Research, 2011
By analysis of the theoretical calculation, it is obvious that the bimetallic bonding of the copper clad aluminum wire by clad drawing at room temperature is the action results of collective gravitation of a great lot of two metal surface atoms reciprocally by outside force.
Yong Qing Ma, Yu Jie Dai, Yu Mei Dai
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By analysis of the theoretical calculation, it is obvious that the bimetallic bonding of the copper clad aluminum wire by clad drawing at room temperature is the action results of collective gravitation of a great lot of two metal surface atoms reciprocally by outside force.
Yong Qing Ma, Yu Jie Dai, Yu Mei Dai
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Journal of Manufacturing Processes, 2017
Abstract A new method is developed for manufacturing bimetallic tubes from pure Copper and 6061-T6 Aluminum tubes by Friction Stir Welding (FSW). The tubes were successfully joined by this new method. Then, the effect of welding parameters such as rotational speed and traverse speed on surface quality, hardness profile, macro and micro-structure and ...
Ahmad Tavassolimanesh, A. Alavi Nia
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Abstract A new method is developed for manufacturing bimetallic tubes from pure Copper and 6061-T6 Aluminum tubes by Friction Stir Welding (FSW). The tubes were successfully joined by this new method. Then, the effect of welding parameters such as rotational speed and traverse speed on surface quality, hardness profile, macro and micro-structure and ...
Ahmad Tavassolimanesh, A. Alavi Nia
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Journal of Materials Processing Technology, 2007
Abstract A three ply clad sheet, comprised of austenitic stainless steel (STS304), aluminum (Al1050) and copper (C1220) was fabricated by means of a hot-rolling process at 350 °C and the mechanical and interfacial properties were investigated for use in cook-ware applications.
Jonghak Lee +5 more
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Abstract A three ply clad sheet, comprised of austenitic stainless steel (STS304), aluminum (Al1050) and copper (C1220) was fabricated by means of a hot-rolling process at 350 °C and the mechanical and interfacial properties were investigated for use in cook-ware applications.
Jonghak Lee +5 more
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International Journal of Minerals, Metallurgy, and Materials, 2016
Copper-clad aluminum (CCA) flat bars produced by the continuous casting–rolling process were subjected to continuous induction heating annealing (CIHA), and the effects of induction heating temperature and holding time on the microstructure, interface, and mechanical properties of the flat bars were investigated.
Xinhua Liu +3 more
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Copper-clad aluminum (CCA) flat bars produced by the continuous casting–rolling process were subjected to continuous induction heating annealing (CIHA), and the effects of induction heating temperature and holding time on the microstructure, interface, and mechanical properties of the flat bars were investigated.
Xinhua Liu +3 more
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The International Journal of Advanced Manufacturing Technology, 2009
In this research, the possibility of applying forming limit diagrams to the formability and fracture prediction of clad metal sheets is examined. The forming limits of clad metal sheets with different thickness combinations (e.g., A1050 1.0, 1.5, 2.0 mm/C1100 1.0 mm) are investigated via forming limits test (punch stretching tests).
Chin Chuan Huang +2 more
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In this research, the possibility of applying forming limit diagrams to the formability and fracture prediction of clad metal sheets is examined. The forming limits of clad metal sheets with different thickness combinations (e.g., A1050 1.0, 1.5, 2.0 mm/C1100 1.0 mm) are investigated via forming limits test (punch stretching tests).
Chin Chuan Huang +2 more
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Thermal characterization of high power LED array in aluminum base copper clad laminate package
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012With the increasing power of a single LED chip and the requirement of more LED chips in one package for high illumination, the conventional LED lamps with the surface mound device-printed circuit board (SMD-PCB) package have met some troubles. In the SMD-PCB package, there has too many thermal interfaces and hence has very high thermal resistance from ...
Chunjin Hang +3 more
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Nonaqueous Rechargeable Aluminum Batteries: Progresses, Challenges, and Perspectives
Chemical Reviews, 2021Jiguo Tu, Wei-Li Song, Haiping Lei
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