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Investigation on the Crimping Strain Characteristics and Reliability of Copper-Clad Aluminum Wire Assemblies

2024 25th International Conference on Electronic Packaging Technology (ICEPT)
Rui Cao   +5 more
openaire   +1 more source

Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires

Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2011
exaly  

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