Results 1 to 10 of about 27,473 (304)
Pulsed Electrodeposition for Copper Nanowires [PDF]
Copper nanowires (Cu NWs) are a promising alternative to indium tin oxide (ITO), for use as transparent conductors that exhibit comparable performance at a lower cost. Furthermore, Cu NWs are flexible, a property not possessed by ITO.
Duc-Thinh Vuong +3 more
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Effect of Cd2+ on Electrodeposition of Copper in Cyclone Electrodeposition
A strategy to determine the effect of Cd2+ on the electrodeposition of copper from a copper electrolyte by cyclone electrowinning is presented. The concentration of Cu2+ in the copper electrolyte with different Cd2+ concentrations was determined by ...
Yan Wang, Bo Li, Hongao Xu, Jihao Guo
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Effect of temperature on the electrodeposition of disperse copper deposits [PDF]
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plateau of the limiting diffusion current density and higher was examined by the determination of the average current efficiency of hydrogen evolution and by ...
Nikolić Nebojša D. +3 more
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The effect of 3–mercapto–1–propanesulfonate sodium salt (MPS), polyethylene glycol (PEG), thiourea (TU) and ethylenethiourea (ETU) on copper electrodeposition from acidic sulfate electrolyte with low Cu2+ concentration was investigated by linear sweep ...
Heng Wang +5 more
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Effect of Fluorocarbon Surfactant on Electroforming of Copper Nano-Powders
The electrodeposition behavior, morphology, and particle size of copper nano-powders prepared using fluorocarbon surfactants or fluorocarbon combined with non-ionic compound surfactants were characterized by linear sweep voltammetry, cyclic voltammetry ...
Zhongbao Luo +5 more
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Copper electrodeposition from a copper acid baths in the presence of PEG and NaCl [PDF]
Copper electrodeposition from copper acid solutions containing PEG and NaCl has been investigated onto Cu(111), Cu(100) and polycrystalline copper electrodes using polarization and EIS measurements. The adsorption of sulphate and chloride anions, and PEG
V. D. JOVIC, B. M. JOVIC
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Copper deposits obtained by pulsating overpotential regime with a long pause and pulse duration from sulfated solutions [PDF]
The morphologies of the copper deposits obtained by pulsating overpotential regime with prolonged pulse and pause durations from the solution of 0.15 M CuSO4 in 0.50 M H2SO4 at overpotentials lower, higher and belonging to the plateau of limiting ...
Shafiei Fatemeh K.T. +2 more
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Copper electrodeposition for 3D integration [PDF]
Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven the semiconductor industry to develop more advanced packaging technologies.
Beica, Rozalia +2 more
openaire +3 more sources
Recovery of Copper Ions from Industrial Wastewater by Electrodeposition
Electrodeposition is an attractive method used for the recovery and removal of metal ions from metal coatings, metal processing and electronic industry wastes.
Ayşe Kuleyin, Hülya Erikli Uysal
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Electrodeposition of Nickel-copper alloy from aqueous solutions in the presence oforganicadditives
On copper substrates, nickel-copper (Ni-Cu) alloy films were deposited from aqueous solutions in the presence of organic additives under galvanostatic conditions.The electrodeposition process and the electrocatalytic behavior of coated thin film were ...
Gharib Qadir, Hassan Hadi
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