Results 141 to 150 of about 751,941 (280)
This study investigates the dynamic electrostatic shielding effect driven by competitive cation adsorption and its role in stabilizing zinc anodes for aqueous zinc metal batteries. The preferential adsorption of R+ cations, particularly K+, effectively rearranges the inner Helmholtz layer, modulates the electric field distribution, and weakens zinc ...
Ziang Wu +9 more
wiley +1 more source
Superhydrophobic and superhydrophilic copper coatings electrodeposited on copper substrate
The aim of the paper was to determine electrochemical deposition conditions for superhydrophobic and superhydrophilic copper coatings on copper substrates.
M. Walkowicz +3 more
doaj
Programmable Axial-Radial Multichannel Nickel Microtubes Fabricated by Core-Filament Jet Electrodeposition. [PDF]
Wang W +5 more
europepmc +1 more source
Magneto-Dendrite Effect: Copper Electrodeposition under High Magnetic Field. [PDF]
Miura M +8 more
europepmc +1 more source
Copper‐doped amorphous high‐entropy hydroxide (CuNiCoFeCrOH) is constructed via one‐step electrodeposition. Cu doping promotes electrochemical reconstruction by accelerating Cr leaching and re‐adsorption, triggering LOM and chloride repellency for efficient water and seawater oxidation.
Chengcheng Dong +6 more
wiley +1 more source
This review systematically examines the fundamental ion‐storage mechanisms, the structural chemistry, and redox behavior of Prussian blue analogs as Faradaic electrodes in capacitive deionization, their intrinsic limitations and engineering optimization strategies, and the critical materials‐to‐device considerations required to advance PBA‐based CDI ...
Adekunle Adedapo Obisanya +4 more
wiley +1 more source
Effect of Bonding Material and Fixing Techniques on the Calibration of Copper-Indium Bimetallic-Coated FBG-Based Cryogenic Temperature Sensors for Aerospace Applications. [PDF]
Alem AK +15 more
europepmc +1 more source
Finite Element Analysis for Li Batteries at the Mesoscale
Finite element analysis (FEA), through multi‐physics coupling, has been widely employed to calculate mesoscale structures in LIBs that exhibit inherent randomness and disorder (Figure a). It has been extensively applied to the investigation of critical phenomena such as Li dendrite evolution, Li+ concentration gradients, SEI film growth, particle ...
Guanwu Li +3 more
wiley +1 more source
High adherence copper plating process
A process is described for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper.
Mignardot, H.
core
Compositional Control of Electrodeposited Co-Ni-Cu Thin Films and Their Behavior in Nitrate Reduction. [PDF]
Filagrossi I, Rony MBB, Podlaha EJ.
europepmc +1 more source

