Results 41 to 50 of about 27,473 (304)

OPTIMIZATION OF SOLUTION POTENTIAL AND TEMPERATURE ON ION ELECTRODEPOSITION PROCESS OF COPPER (II) USING AN ADDITIVE OF FORMALDEHYDE [PDF]

, 2011
This research was conducted at the Chemical Research Laboratory of State University of Yogyakarta (UNY), Instruments Analysis Laboratory of Indonesian Islamic University (UII), and the Research Center for Physics of Indonesian Institute of Sciences (LIPI)
Fitria Rizana, -
core  

Deposition and characterization of copper chalcopyrite based solar cells using electrochemical techniques [PDF]

, 2007
Cu(In,Ga)Se2 films were electrodeposited on molybdenum substrates from a single pH buffered bath and annealed in a reducing selenium atmosphere. The opto-electronic properties of the films were characterized using a potentiostatically- controlled three ...
Dale, Phillip, Forbes, Ian, Peter, Laurence, Roncallo, Scilla, Samantilleke, A. P., Zoppi, Guillaume   +5 more
core   +1 more source

Toward Scalable Solutions for Silver‐Based Gas Diffusion Electrode Fabrication for the Electrochemical Conversion of CO2 – A Perspective

Advanced Functional Materials, EarlyView.
In this study, the preparation techniques for silver‐based gas diffusion electrodes used for the electrochemical reduction of carbon dioxide (eCO2R) are systematically reviewed and compared with respect to their scalability. In addition, physics‐based and data‐driven modeling approaches are discussed, and a perspective is given on how modeling can aid ...
Simon Emken, K. Ashoke Raman, Alexander Bauer, Violeta Karyofylli, Eva Jodat, André Karl, Rüdiger‐A. Eichel   +6 more
wiley   +1 more source

High density p-type Bi0.5Sb1.5Te3 nanowires by electrochemical templating through ion-track lithography [PDF]

, 2009
High density p-type Bi0.5Sb1.5Te3 nanowire arrays are produced by a combination of electrodeposition and ion-track lithography technology. Initially, the electrodeposition of p-type wBi(0.5)Sb(1.5)Te(3) films is investigated to find out the optimal ...
Beeby, Steve P., Koukharenko, Elena, Li, Xiaohong, Nandhakumar, Iris S., Tudor, John, White, Neil M.   +5 more
core   +1 more source

Three‐Dimensional Hierarchical Nanowire‐Networks with Deep‐Focus Tolerance and Adhesion Robustness for Harsh‐Environment SERS Sensing

Advanced Functional Materials, EarlyView.
A 3D nanowire‐network SERS substrate with robust adhesion is developed, featuring pronounced z‐direction optical activity, ultralow detection limit (1.5 × 10−13 M), and excellent signal uniformity (RSD < 10%). Enabled by enhanced light scattering, increased optical density of states, and structural reinforcement, the substrate demonstrates stable, high‐
Jinglai Duan, Wentao Wang, Xiu Liang, Yongliang Zhang, Jie Liu, Yu Bai, Dangyuan Lei   +6 more
wiley   +1 more source

Electrocatalytic Reduction of CO2 to Ethylene: Catalyst Design and Synchrotron‐Based Characterizations

Advanced Functional Materials, EarlyView.
This review evaluates strategies for electrochemical CO2 reduction to ethylene, focusing on copper‐based catalyst design and microenvironment modulation to achieve industrial‐grade performance. By leveraging operando synchrotron‐based characterizations, we provide a multiscale understanding of dynamic structural transformations and key reaction ...
Meng Zhang, Zuolong Chen, Yimin A. Wu
wiley   +1 more source

The effect of the particle shape and structure on the flowability of electrolytic copper powder. III. Amodel of the surface of a representative particle of flowing copper powder electrodeposited by re [PDF]

Journal of the Serbian Chemical Society, 2004
The structure of the surface of copper powder particles is discussed and correlated with the lowest apparent density at which copper powder can still flow.
Popov Konstantin I., Krstić Snežana B., Obradović Milutin Č., Pavlović Miomir G., Pavlović Ljubica J., Ivanović Evica R.   +5 more
doaj   +1 more source

Effects of Additives in an Electrodeposition Bath on the Surface Morphologic Evolution of Electrodeposited Copper

International Journal of Electrochemical Science, 2021
Additives in an electrodeposition bath have been frequently used to modulate the morphology of electrodeposited copper. The effects of gelatin, thiourea and chloride ions under various concentrations on electrodeposited copper were studied.
Tsung-Wei Zeng, Shi-Chern Yen
doaj   +1 more source

Damping of Fe-Al Alloy Electrodeposited in an Ionic Liquid [PDF]

, 2018
Iron-Aluminium alloys were produced by the electro-deposition of iron-aluminium on a copper substrate. The electro-deposition process was done in the ionic liquid 1-butyl-1-methylpyrrolidinium trifluoromethylsulfonate, [Py1,4]TfO.
Bernd Weidenfeller (5341862), Federico Guillermo Bonifacich (5341859), Frank Endres (1362063), Giridar Pulletikurthi (5862863), Jiayi Xu (2287153), Laura Weidenfeller (5862866), Osvaldo Agustin Lambri (5862851)   +6 more
core   +2 more sources

Interfacial and Crystallographic Regulation of Zinc Anode via Electric Double Layer Reconstruction for Highly Stable Zn Anode

Advanced Functional Materials, EarlyView.
Trace amounts of perfluoro‐1‐butanesulfonyl fluoride enables the regulation of the Zn/electrolyte interface by the generated zincophilic ─SO3H groups with long hydrophobic ─CF2 tails, which adsorb strongly onto the Zn surface, displace water molecules from the inner Helmholtz plane, and reconstruct the electrical double‐layer structure.
Dinesh Patel, Yimei Chen, Ashwini Kumar Sharma, Xiaolei Wang   +3 more
wiley   +1 more source