Results 71 to 80 of about 5,668 (255)
Copper nano-clusters prepared by one-step electrodeposition and its application on nitrate sensing
This paper describes the fabrication and characterization of copper nano-clusters prepared by a simple one-step electrodeposition process on platinum microelectrode, and the application for nitrate determination. The one-step electrodepostion process was
Y. Li +6 more
doaj +1 more source
In this study, the kinetics of acid leaching of a spent catalyst containing CuO was investigated. The effect of key parameters such as type of acid (H2SO4, HCl, Oxalic acid), concentration of acid (0.5–2 M), stirring speed (200–600 rpm), liquid to solid ...
Moataz Ali El-Okazy +2 more
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This overview summarizes versatile 2D layered materials for AZIB anodes, cathodes, separators and electrolytes, illustrating their dendrite/side reaction suppression mechanisms, and analyzes existing hurdles to propose scalable commercial research outlooks.
Shuge Dai +7 more
wiley +1 more source
Metal‐anode batteries using Li, Na, Mg, and Ca offer exceptionally high energy density, but dendrites, unstable interphases, cracking, and pore formation hinder durability and safety. This review shows how careful electrolyte and interphase design can stabilize these reactive metals.
Jian Pan +3 more
wiley +1 more source
A chlorine‐functionalized silane modifier (CPTMS) is introduced to cooperatively regulate CO2 reduction to C2+ products on Cu‐based catalysts. Dual‐functional interface sequentially enhances CO2 activation, intermediates protonation and C─C coupling, delivering a 5‐fold increase in C2+ faradaic efficiency (FE, 75% vs.
Ying Ying Ch'ng +14 more
wiley +1 more source
Effect of Thiourea on the Copper Electrodeposition
The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass ...
Joo-Yul Lee +3 more
openaire +1 more source
Surface and Interfacial Engineering toward Durable Mechanically Coupled Flexible Electronics
This Review highlights how surface and interfacial engineering governs the reliability, durability, and functional stability of mechanically coupled flexible electronics. By integrating fundamental interfacial theory, failure mechanisms, multiscale engineering strategies, and representative applications, it provides a design‐oriented framework for ...
Qian Wang, Fangfang Dai, Wei Wu
wiley +1 more source
From Devices to Systems: Integration Strategies for Micro‐Supercapacitors in Microsystems
Micro‐supercapacitors are evolving from device‐level energy storage toward system‐level functional units in integrated microsystems. This Review presents a system‐oriented design framework in which integration serves as the key link between application requirements, system constraints, device architectures, and material selection. Monolithic and hybrid
Zhuohao Liu, Gang Li, Kaiying Wang
wiley +1 more source
This study presents a NiO–NiCo heterostructure electrode that enhances water dissociation and hydrogen adsorption through synergistic interfacial interactions, verified by electrochemical and spectroscopic analyses. Its high performance in a large‐area single‐cell system under dynamic conditions demonstrates how rational non‐precious catalyst design ...
Jinwoo Lee +11 more
wiley +1 more source
The effect of the particle shape and structure on the flowability of electrolytic copper powder. III. A model of the surface of a representative particle of flowing copper powder electrodeposited by reversing current [PDF]
The structure of the surface of copper powder particles is discussed and correlated with the lowest apparent density at which copper powder can still flow.
EVICA R. IVANOVIC +5 more
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