Results 221 to 230 of about 25,242,166 (355)
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan +5 more
wiley +1 more source
Economic returns on investing in early childhood development in Vietnam: a cost-benefit analysis. [PDF]
Baek Y +11 more
europepmc +1 more source
Measuring the unmeasurable: Cost-benefit analysis for new business start-ups and scientific research transfers [PDF]
Maria Papadakis, Albert N. Link
openalex +1 more source
The utilization of direct energy deposition (DED)‐arc additive manufacturing processes in industrial applications is increasing, and these processes have the potential for multi‐material applications. This work provides a overview of the state of research in DED‐arc made functional graded structures, to establish a link to potential industrial ...
Kai Treutler, Volker Wesling
wiley +1 more source
Cubic Bézier curves are used in the synthesis of novel surface‐based metamaterials with tunable mechanical properties. Surface‐based geometries are 3D printed and tested in compression. The resulting mechanical properties are correlated to changes in the shape of the base curve, with high potential in energy absorption through the adjustment of their ...
Alberto Álvarez‐Trejo +2 more
wiley +1 more source
A Cost-Benefit Analysis of Bivalent Covid-19 Vaccines. [PDF]
Lin DY, Xu Y, Zeng D, Sunny SK.
europepmc +1 more source

