Results 241 to 250 of about 960,076 (299)

Vision-Based Artificial Intelligence for Adaptive Peen Forming: Sensing Architectures, Learning Models, and Closed-Loop Smart Manufacturing. [PDF]

Sensors (Basel)
Farooq SS, Rehman A, Al-Yarimi FAM, Park S, Baik J, Lee H.   +5 more
europepmc   +1 more source

Enhancing Ultrasonic Crack Sizing Accuracy in Rails: The Role of Effective Velocity and Hilbert Envelope Extraction. [PDF]

Micromachines (Basel)
Ho TT, Dao TT.
europepmc   +1 more source

Efficient Prestress Wedge Flaw Detection Using a Lightweight Computational Framework. [PDF]

Sensors (Basel)
Yao Q, Guo Y, Liu W.
europepmc   +1 more source

Multimodal fault detection model for photovoltaic modules. [PDF]

Sci Rep
Yu S, Gan F, Han T, Hou S, Feng X, Chen K.   +5 more
europepmc   +1 more source

Mesoscopic Heterogeneous Modeling Method for Polyurethane-Solidified Ballast Bed Based on Virtual Ray Casting Algorithm. [PDF]

Materials (Basel)
Xu Y, Sheng Z, Zhang J, Han H, Ling X, Zhang X, Qie L.   +6 more
europepmc   +1 more source

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A mixed inspection policy for CSP-1 and precise inspection under inspection errors and return cost

Computers and Industrial Engineering, 2009
This paper is to deal with a mixed policy between precise inspection and CSP-1 with inspection errors (Types I and II) and return cost. First, the concept of a renewal reward process is employed to obtain the long-term net profit of the mixed inspection policy.
Hong-Fwu Yu
exaly   +2 more sources

Product inspection policy for an imperfect production system with inspection errors and warranty cost

European Journal of Operational Research, 2016
zbMATH Open Web Interface contents unavailable due to conflicting licenses.
Biswajit Sarkar, Sharmila Saren, Biswajit Sarkar   +2 more
exaly   +3 more sources

Modeling the cost of ownership of assembly and inspection

IEEE Transactions on Components, Packaging and Manufacturing Technology Part C Manufacturing, 1996
While the semiconductor industry may have the technologies required for the next 15 years of growth, the ability to implement these technologies in cost effective, competitive products is in question. The same impediment may also impact board and system level electronics.
D.L. Dance, T. DiFloria, D.W. Jimenez
exaly   +2 more sources