Results 181 to 190 of about 899,756 (284)

Evolution of Materials and Device Stacks for HfO2‐Based Ferroelectric Memories

Advanced Materials Interfaces, EarlyView.
This review summarizes engineering strategies for HfO2 based ferroelectric memories with focus on FeCAP and FeFET structures. It describes how dopant design, stress effects, and interface engineering improve the bulk ferroelectric response. It further discusses how channel engineering supports reliable memory characteristics and scalable integration ...
Eunjin Kim, Jiyong Woo
wiley   +1 more source

Key Measures for Evaluating Diagnostic Accuracy in Multi-Class Classification: An Overview and Simulation-Based Comparison. [PDF]

Korean J Radiol
Ryu L, Han K, Jung I, Park YW, Ahn SS, Hwang D.   +5 more
europepmc   +1 more source

Topological Point Defects in SmC* Liquid Crystals Under Mechanical Disturbance

Advanced Materials Interfaces, EarlyView.
Tangetial air jet shear inducess island formation and nucleates topological point defects in uniform SmC films. Island bounded by edge dislocation loops shrink and transform into isolated point defects under continued shear. Mechanical perturbatio provides a controllable route for defect engineering in smectric liquid crystal thin films.
Gunganist Kongklad, Vandana Molahalli, Apichart Pattanaporkratana, Nattaporn Chattham   +3 more
wiley   +1 more source

Correcting for publication bias in a meta-analysis with the p-uniform* method. [PDF]

Psychon Bull Rev
van Aert RCM, van Assen MALM.
europepmc   +1 more source

Perfusion Bioreactor Culture Incorporating Mechanical Confinement Enhances Mesenchymal Stem Cell Extracellular Vesicle Production and Wound Healing Potential

Advanced Materials Technologies, EarlyView.
Scalable manufacturing challenges and limited potency remain two of the most intransigent issues limiting clinical translation of EV therapeutics. Mechanical cues can induce phenotypic changes and increased vesiculation in EV source cells without the use of extraneous reagents, chemicals, and/or cargo, thereby potentially drastically improving the ...
Emily H. Powsner, Raith Nowak, Stephanie M. Kronstadt, Nicholas H. Pirolli, Talia J. Solomon, Kristin Nikolov, William Pieper Holeman, Ian M. Smith, Kimberly M. Stroka, John P. Fisher, Steven M. Jay   +10 more
wiley   +1 more source

Sociodemographic determinants of health care in heart failure mortality in Mexico, 019 and 2023. [PDF]

Rev Bras Epidemiol
Campuzano JC, Rodríguez JM, Chaparro PE, Urrego DC, Hernández A.   +4 more
europepmc   +1 more source

Smart Closed‐Loop Systems in Personalized Healthcare: Advances and Outlook

Advanced Materials Technologies, EarlyView.
A smart closed‐loop e‐textile integrates multimodal sensing, onboard processing, wireless communication, and wearable power to enable real‐time physiological/biochemical monitoring and feedback‐controlled therapy. ABSTRACT Smart textiles represent a revolutionary frontier in healthcare, seamlessly blending fabric and advanced technologies to create ...
Safoora Khosravi, Sang Won Lee, Mohammad Abrar Uddin, Sina Hassanpoor, Neha Suvindran, Katherine Le, Harun Arkaz, Harishkumar Narayana, Saeid Soltanian, Danial Khorsandi, Negar Hosseinzadeh Kouchehbaghi, Taeil Kim, Yangzhi Zhu   +12 more
wiley   +1 more source

Timing of the fourth dose of RTS,S/AS01 malaria vaccine in perennial settings: a modelling study. [PDF]

Malar J
Figueroa-Downing D, Kelly SL, Cavelan A, Penny MA, Malinga J.   +4 more
europepmc   +1 more source

Coverage Probability Fails to Ensure Reliable Inference [PDF]

, 2019
Balch, Michael, Martin, Ryan, Ferson, Scott   +2 more
openaire  

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

Advanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco, Nicola Larovere, Antonio Zagaria, Antonio Pavone, Rosanna Rifino, Gianni Stano   +5 more
wiley   +1 more source