Results 211 to 220 of about 68,107 (316)

Elephant‐Skin‐Inspired Porous Cementitious Tiles with Programmable Crack Networks for Passive Cooling

Advanced Materials, EarlyView.
Elephant‐skin‐inspired crack networks are programmed in porous diatomaceous earth (DE)‐cement composites using substrate‐guided, stress‐concentration induced fracture. The resulting crack lattices act as capillary conduits that redistribute water, while the porous matrix stores moisture.
Qingya Huang, Kun‐Hao Yu, Ji Yoon Bae, Yunchan Lee, Dorit Aviv, Shu Yang   +5 more
wiley   +1 more source

Toughening Effect of Micro-Cracks on Low-Temperature Crack Propagation in Asphalt Concrete. [PDF]

Materials (Basel)
Du J, Dai X, Liu Q, Fu Z.
europepmc   +1 more source

Neuromorphic Electronics for Intelligence Everywhere: Emerging Devices, Flexible Platforms, and Scalable System Architectures

Advanced Materials, EarlyView.
The perspective presents an integrated view of neuromorphic technologies, from device physics to real‐time applicability, while highlighting the necessity of full‐stack co‐optimization. By outlining practical hardware‐level strategies to exploit device behavior and mitigate non‐idealities, it shows pathways for building efficient, scalable, and ...
Kapil Bhardwaj, Roshni Satheesh Babu, Yuxin Xia, Eva Bestelink, Radu Sporea, Nikos Hastas, Ioannis Zeimpekis, Dimitra G. Georgiadou, Sayani Majumdar   +8 more
wiley   +1 more source

Crack Propagation of Ceramsite Lightweight Concrete Under Four-Point Bending Fatigue Conditions. [PDF]

Materials (Basel)
Yang K, Zhuang S, Wang Y, Li J, Zhou S, Ren J.   +5 more
europepmc   +1 more source

Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics

Advanced Materials, EarlyView.
“Leaftronics” transforms naturally evolved leaf venation into quasi‐fractal scaffolds for sustainable electronics. Polymer‐infiltrated leaf skeletons can be used to fabricate ultra‐smooth, reflow‐ and thin‐film‐compatible decomposable substrates, while making the same lignocellulose networks conducting results in flexible transparent electrodes.
Rakesh Rajendran Nair, Hrisheekesh Thachoth Chandran, Karl Leo, Hans Kleemann   +3 more
wiley   +1 more source

Numerical simulation of crack propagation and AE precursor characteristics in coal failure under confining pressures. [PDF]

Sci Rep
Jing G, Wang S, Zhao L, Dong F, Fan Y.
europepmc   +1 more source

AI–Guided 4D Printing of Carnivorous Plants–Inspired Microneedles for Accelerated Wound Healing

Advanced Materials, EarlyView.
This work presents an artificial intelligence (AI)‐guided 4D‐printed microneedle platform inspired by carnivorous plants for wound healing. A thermo‐responsive shape memory polymer enables body temperature–triggered self‐coiling for autonomous wound closure.
Hyun Lee, Moon‐Jo Kim, DongEung Kim, Chan Ho Moon, Seojoon Bang, Hyeong Seok Kang, Ju Yeong Gwon, Jong Hwa Seo, Junhyub Jeon, Junhyuk Son, Munwon Lim, Minho Kang, Dong Yun Lee, Donghyun Lim, Jung‐Hoon Park, Gi Doo Cha, Soo‐Hong Lee, Tae‐Sik Jang, Kisuk Yang, Yunho Jeong, Youngho Eom, Hyun‐Do Jung   +21 more
wiley   +1 more source

Multiscale Simulation of Crack Propagation in Impact-Welded Al₄Cu₉ Alloy Based on Cohesive Zone Model. [PDF]

Materials (Basel)
Luo R, Xiao D, Pei G, Yan H, Han S, Jiang J, Zhang M.   +6 more
europepmc   +1 more source

Measuring the Hall Effect in Hysteretic Materials

Advanced Materials, EarlyView.
The authors highlight common pitfalls in measuring the Hall effect: in hysteretic magnets, improper data processing can create signals that look exotic but are not real. This Perspective explains the origin of these artifacts and presents practical measurement strategies that help researchers identify reliable Hall responses in complex magnetic ...
Jaime M. Moya, Anthony Voyemant, Sudipta Chatterjee, Scott B. Lee, Grigorii Skorupskii, Connor J. Pollak, Leslie M. Schoop   +6 more
wiley   +1 more source

Research on crack propagation characteristics and mechanical mechanism around gas drainage boreholes. [PDF]

Sci Rep
Liu H, Jia B, Zhang K, Liu C, Zhang S, Sun Y, Li R.   +6 more
europepmc   +1 more source