Results 231 to 240 of about 14,215 (312)

Ultra‐Wide‐Field Noninvasive Imaging Through Scattering Media Via Physics‐Guided Deep Learning

Advanced Science, EarlyView.
We propose a physics‐guided adaptive dual‐domain learning method for ultra‐wide‐field noninvasive imaging through scattering media, namely UNI‐Net. Our method not only reduces the requirement for real experimental data by an order of magnitude but also enables clear imaging of complex scenes with an ultra‐large field of view, which is 164 times the OME
Lintao Peng, Mingwei He, Jeff Zhu, Sujit K. Sahoo, Liheng Bian, Cuong Dang   +5 more
wiley   +1 more source

Finite element analysis of flexural behavior of UHPC-strengthened RC beams based on experimental calibration. [PDF]

Sci Rep
Wang J, Li Z.
europepmc   +1 more source

Topology‐Enriched Toughness Enhancement in Quasi‐Periodic Metastructures Featuring Tailorable Strong‐Weak Network

Advanced Science, EarlyView.
A quasi‐periodic Dart‐Kite (QDK) metastructure with a golden‐ratio‐constrained strong–weak bond network simultaneously enhances strength, toughness, and damage tolerance. Its distributed topology enables predictable, tailorable crack paths for precise fracture control and stable mechanics, demonstrating a high‐performance, controllable architecture ...
Tianyu Gao, Genda Wang, Jiabao Bai, Kai Liu   +3 more
wiley   +1 more source

Molecular Dynamics Investigation of Thickness Effects on Tensile Fracture and Component Migration in Asphalt Films. [PDF]

Materials (Basel)
Wang R, Zhao Y, Fu G, Wang Y, Sun Q, Zhao Y.   +5 more
europepmc   +1 more source

Silicon‐Embedded Multifunctional Heterogeneous Integration for Miniaturized Photoplethysmography Detection Devices

Advanced Science, EarlyView.
ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen, Shizun Hu, Zhou Yang, Shitao Shen, Pan Zhang, Han Xu, Chi Zhang, Wei Wang   +7 more
wiley   +1 more source

Dynamic Failure Behavior of Conglomerate under Impact Loading: Experimental and Numerical Insights for CO₂ Storage Applications. [PDF]

ACS Omega
Cheng W, Lou Y, Zhu L.
europepmc   +1 more source

Data‐Driven Modeling of Composition–Processing–Microstructure Relations for Recycled Aluminum Cast Alloys

Advanced Science, EarlyView.
Interpretable machine learning reveals how composition and processing govern the formation and microstructural burden of Fe‐rich intermetallic compounds in recycled Al–Si–Fe–Mn alloys. By separating morphology selection from morphology‐conditioned burden partitioning, this framework shows that identical Fe contents can yield different intermetallic ...
Jaemin Wang, Waleed Mohammed, Dierk Raabe   +2 more
wiley   +1 more source

Bioinspired Reversible Adhesive with High Strength for Wearable Electronics under Diverse Environments. [PDF]

Research (Wash D C)
Wu Y, Liu H, Tian H, Li X, Wang D, Sun B, Zhao Q, Zhang J, Lan T, Liu G, Chen X, Wang C, Shao J.   +12 more
europepmc   +1 more source

A Crack‐Based One‐Dimensional Microspheres Array Enables Thermal–Mechanical Decoupled Dual‐Functional Sensing

Advanced Science, EarlyView.
Inspired by Nostoc, a crack‐based one‐dimensional microspheres array (COMA) sensor is developed, which stabilizes crack geometry under isotropic expansion, enabling a predictable, monotonic thermal response from which true strain can be accurately extracted. The COMA sensor exhibits high sensitivity at ultralow deformation (gauge factor up to 89) and a
Wanqing Xu, Hongyi Tu, Zehao Wang, Tianyu Zhu, Chao Wang, Min Chen, Lan Shi, Limin Wu   +7 more
wiley   +1 more source

Analysis of Post-Bonding Crack-Induced Double Cantilever Bending (PDC-DCB) Method for Hybrid Bonding Strength Measurement. [PDF]

Materials (Basel)
Mei C, Zheng T, Hu Q, Chen Y, Xu Y, Zhao H, Chang L, Yuan Y, Yu Z, Li L.   +9 more
europepmc   +1 more source