Results 101 to 110 of about 15,135,820 (245)

Balanced Adversarial Tight Matching for Cross-Project Defect Prediction

IET Software
Cross-project defect prediction (CPDP) is an attractive research area in software testing. It identifies defects in projects with limited labeled data (target projects) by utilizing predictive models from data-rich projects (source projects).
Siyu Jiang, Jiapeng Zhang, Feng Guo, Teng Ouyang, Jing Li   +4 more
doaj   +1 more source

Materials‐Driven Additive Manufacturing for Electrical Machines: Qualification‐Oriented Design Beyond Geometric Freedom

Advanced Engineering Materials, EarlyView.
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley   +1 more source

Supporting AI Readiness Through Digital Workflows in Materials Science

Advanced Engineering Materials, EarlyView.
Digitalization drives innovation in materials science by connecting data silos and turning heterogeneous processes into reusable research pipelines. Across 13 MaterialDigital projects, digital workflows reveal complementary pathways toward AI‐ready materials research, founded on structured data, persistent artifacts, executable orchestration, and ...
Marian Bruns, Lateef Abdul, Stephan Barth, Martin Glauer, Manuel Günther, Fabian Neuhaus, Jan‐Ole Perschewski, Thomas Bjarsch, Henrik Abel, Johannes Bosch, Niklas Meyer, Peter Hofmann, Marc Drechsler, Alexander Dyck, Dhanunjaya Kumar Nerella, Marvin Tegeler, Oleg Shchyglo, Ingo Steinbach, Timo Klecker, Henk Birkholz, Ehsan Borzabadi Farahani, Bernard Fedelich, Cetin Haftaoglu, Tarakeshwar Lakshmipathy, Elena Garcia Trelles, Christoph Schweizer, Reza Darvishi Kamachali, Lukas Koschmieder, Janin Eiken, Markus Apel, Sung‐Min Wi, Jiangdong Zhao, Andreas Fezer, Nicolas Christ, Patrick Schneider, Eldor Urinov, Veit Königer, Volker Knoblauch, Janik Harter, Thomas Seifert, Thitichai Janpheng, Florian Fuchs, Fabian Teichert, Jörg Schuster, Anke Bardehle, Andreas Limper, Ulrich Giese, Carlos Lucke, Mario Beiner, Christoph Gögelein, Lisa Leuchtenberger‐Engel, Christian Hopmann, Felix Wentzien, Heike Wittek, Benjamin Klie, Alexander Röhrs, Ludger Overmeyer, Achraf Atila, Marcel Sadowski, Leopold Talirz, Jan Janssen, Jesper R. Pedersen, Peter Beck, Tejs Vegge, Ivano E. Castelli, Wolfgang Wenzel, Tilmann Hickel, Jörg Schaarschmidt   +67 more
wiley   +1 more source

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source

The influence of machine learning on the predictive performance of cross-project defect prediction: empirical analysis [PDF]

This empirical investigation delves into the influence of machine learning (ML) algorithms in the realm of cross-project defect prediction, employing the AEEEEM dataset as a foundation.
Sharif, Khaironi Yatim, Samat, Pathiah Abdul, Bala, Yahaya Zakariyau, Manshor, Noridayu   +3 more
core   +3 more sources

A Multi‐Scale Machine Learning Framework for the Inverse Design of High Entropy Alloys

Advanced Engineering Materials, EarlyView.
High‐entropy alloys offer vast potential for various applications, including electrocatalysis; however, their compositional complexity challenges conventional screening. We introduce an inverse‐design framework combining two neural networks to determine optimal compositions and reconstruct nanoparticle geometry from targeted properties and conventional
Mikael Takoutsin, Marta Campolucci, Nicolas de Andrade Ishiki, Nathan Mirgot, Nadir Zhamantay, Frédéric Kanoufi, Jennifer Peron, Jean Charlety, Emiliano Fonda, Valérie Briois, Marco Faustini, Maria‐Letizia De Marco, Christine Goyhenex, Ovidiu Ersen, Hervé Bulou   +14 more
wiley   +1 more source

Within-project and cross-project software defect prediction based on improved transfer Naive Bayes algorithm

, 2020
With the continuous expansion of software scale, software update and maintenance have become more and more important. However, frequent software code updates will make the software more likely to introduce new defects.
Wang, Xu, Ying, Shi, Zhu, Kun, Zhang, Nana, Wang, Xu; id_orcid   +4 more
core   +1 more source

Detecting Anomalous Cell Behavior in Electrochemical Battery Testing Using Machine Learning

Advanced Engineering Materials, EarlyView.
Machine‐learning‐based screening enables automated identification of anomalous battery cells from complementary electrochemical tests. A curated battery database supports configuration‐aware comparison of rate‐capability and impedance data. Supervised classification of rate‐test data achieves 90% accuracy, while CNN‐VAE‐based impedance analysis reaches
Minu Rose, Sanxchep Sharma, Veit Königer, Vincent Nebel, Jonas Oehm, Christian Weisenberger, Laura Bies, Volker Knoblauch   +7 more
wiley   +1 more source

Multi View Natural Network for Cross-Project Software Defect Prediction [PDF]

Software Defect Prediction (SDP) plays a critical role in software engineering by enabling early identification of potentially defective modules, to assist developers and testers in prioritizing testing and inspection efforts to improve software quality ...
Setiawan, Boy, Subekti, Agus
core   +2 more sources

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source