Results 241 to 250 of about 1,899,382 (347)
General method for carbon-heteroatom cross-coupling reactions via semiheterogeneous red-light metallaphotocatalysis. [PDF]
Song G+13 more
europepmc +1 more source
Multiscale Modeling of Process‐Induced Defects in Fused Filament Fabrication‐Printed Materials
This study presents a predictive multiscale modeling tool for defect analysis of fused filament fabricated‐printed materials and their performance prediction using a mechanistic data science‐based reduced‐order modeling approach. Process‐induced defects are inherent to additively manufactured parts and significantly influence the performance of printed
Satyajit Mojumder+3 more
wiley +1 more source
Photocatalyzed C(sp<sup>3</sup>)-N Bond Activation of Isonitriles for Mizoroki-Heck Cross-Coupling with Vinyl Arenes. [PDF]
Wood AB, Mizuno N, Jung S, Schuppe AW.
europepmc +1 more source
In this research, ZrC coatings are evaluated against various counterprobes at the microscale using novel super‐stiff atomic force microscopy cantilevers. The chemical composition of the coating is shown to be an important factor influencing coating hardness and Young's modulus, while surface roughness, counterprobe hardness, and surface energy are the ...
Piotr Jenczyk+4 more
wiley +1 more source
CROSS REACTIONS BETWEEN HUMAN TRANSPLANTATION ANTIGENS AND BACTERIAL LIPOPOLYSACCHARIDES1
Arthur A. Hirata+3 more
openalex +1 more source
Trends in organic peroxide (ROOR) formation in the reactions of C1-C4 alkyl peroxy radicals (RO<sub>2</sub>) in gas. [PDF]
Nozière B.
europepmc +1 more source
Additive manufacturing technologies like laser powder‐bed fusion offer great design freedom and individualization of products down to a batch size of one. However, parts fabricated with this technology suffer from poor quality. Acoustic assistance during the build process can minimize these drawbacks.
Oliver Maurer, Dirk Bähre
wiley +1 more source
Cross sections for /p, xn/ reactions, and astrophysical applications
R. Silberberg, C. H. Tsao
openalex +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
High‐Temperature Oxidation of the CrFeNi Medium‐Entropy Alloy
The oxidation behavior of equiatomic CrFeNi MEA is a key issue that determines this material's suitability for high‐temperature application. The understanding of long‐term behavior is even more crucial than short‐term corrosion effects. The alloy is exposed to synthetic air at 1000, 1050, and 1100 °C for 24, 100, and 1000 h and systematically compared ...
Anna Maria Manzoni+5 more
wiley +1 more source