Results 101 to 110 of about 24,007,409 (240)

Morphology and Phase Formation During the Solidification of Al-Cu-Si and Al-Ag-Cu Ternary Eutectic Systems

open access: yes, 2018
The microstructure of ternary alloys in the Al rich corner of the Al-Cu-Si and Al-Ag-Cu systems were analyzed in order to determine the solidification path in the different structural regions expected from the equilibrium phase diagram.
Osvaldo Fornaro (4896190)   +1 more
core   +1 more source

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

open access: yesAdvanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz   +4 more
wiley   +1 more source

Stress Intensity Factor for Aluminum and Copper Spot Weld Joints

open access: yesJournal of Applied Science and Engineering
For decades, resistance spot welding (RSW) between aluminum and copper has encountered difficulties; however, it remains essential for modern applications.
Marwah Sabah Fakhri   +2 more
doaj   +1 more source

Auger electron spectroscopy analysis of grain boundary microchemistry in an Al-Cu-Li alloy

open access: yes, 2016
In situ impact fracture combined with Auger electron spectroscopy (AES) was employed to determine grain boundary (GB) microchemistry, namely lithium (Li) concentration, for an Al-Cu-Li alloy.
N Birbilis (13356093)   +4 more
core  

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

open access: yesAdvanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw   +3 more
wiley   +1 more source

Effect of Copper Content on the Microstructure and Properties of the Sintered Porous Aluminum Wick

open access: yesMetals
Porous aluminum has been widely used as a wick, an electrode, and in other products, due to its advantages of a light weight, pore uniformity, and corrosion resistance.
Yanbo Cai, Bohua Duan
doaj   +1 more source

Influence of TiC and TiN Ceramic Reinforcements on the Microstructure, Thermal Expansion Behavior, and Tensile Properties of Invar 36 Manufactured by Laser Powder Bed Fusion

open access: yesAdvanced Engineering Materials, EarlyView.
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji   +3 more
wiley   +1 more source

Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning

open access: yesAdvanced Engineering Materials, EarlyView.
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley   +1 more source

Structural and Textural Properties of Al/Cu- and Al/Zn-Pillared Clays for Ethanol Conversion

open access: yesCrystals
A montmorillonite sample was pillared using mixed solutions of Al/Cu and Al/Zn as the pillaring agent. Al/Cu- and Al/Zn-pillared clays were applied in an ethanol conversion reaction.
Lamara M. dos Santos   +4 more
doaj   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

open access: yesAdvanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová   +6 more
wiley   +1 more source

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