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Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding
Journal of the Taiwan Institute of Chemical Engineers, 2022Abstract Background Cu-Cu direct bonding is a promising technology to construct a temperature resistant bonding structure for emerging power devices and vehicle electronics. The main challenge is the ease oxidation of Cu and slow solid-state atomic diffusion at the bonding surface.
Jhih-Jhu Jhan +3 more
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An Energetic CuS–Cu Battery System Based on CuS Nanosheet Arrays
ACS Nano, 2021The development of low-cost and high-energy aqueous battery technologies is of significance for renewable and stationary energy applications. However, this development has been bottlenecked by poor conductivity, low capacity, and limited cycling stability of existing electrode materials. In this work, we report on an energetic aqueous copper ion system
Yichun Wang +4 more
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Cu Elimination from Cu-Coordinating Macromolecules
ACS Macro Letters, 2017We demonstrate a simple, fast, and efficient process for the elimination of Cu impurities from water-soluble Cu-coordinating macromolecules that are difficult to purify via standard polymer purification techniques. The process is based on the complexation and precipitation of Cu by sodium diethyldithiocarbamate and was investigated for two different ...
Morten F. Ebbesen +3 more
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Derivatives (Cu/CuO, Cu/Cu2O, and CuS) of Cu superstructures reduced by biomass reductants
Materials Today Chemistry, 2021Abstract Metallic Cu is considered as the promising functional material owing to its high conductivity and harmlessness. Here, metallic Cu which presents a unique interconnected and continuous structure (Cu superstructure) is prepared using Magnolia grandiflora leaves as the biomass reductant, a green process which avoided the release of harmful ...
Meijuan Yuan, Xiaotian Guo, Huan Pang
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Activity of oxygen in Cu-Au, Cu-Ag, Cu-Pt, Cu-Ni, Cu-Co and Cu-Fe alloys
Canadian Metallurgical Quarterly, 1970AbstractThermodynamic properties of dilute solutions of oxygen in liquid Cu-Au, Cu-Ag, Cu-Pt, Cu-Ni, Cu-Co and Cu-Fe alloys have been studied by means of the hydrogen water vapour equilibrium. The following reactionH2(g)+[O]soln = H2O(g)was studied for which an equilibrium ratio can be written: K = PH2O/ PH2 [at.
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Diffusion of Cu on Cu surfaces
Physical Review B, 1995Diffusion of a single Cu adatom on low-index Cu surfaces with different morphologies (with and without the presence of other Cu adatoms as well as near and over stepped surfaces) is studied using the embedded-atom method and a molecular static simulation.
, Karimi, , Tomkowski, , Vidali, , Biham
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Chemischer Informationsdienst, 1986
AbstractThe mononuclear Cu complex (I) reacts with copper perchlorate in water to form the title complex (II) which crystallizes in the space group P21/c with Z=4.
Y. JOURNAUX, J. SLETTEN, O. KAHN
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AbstractThe mononuclear Cu complex (I) reacts with copper perchlorate in water to form the title complex (II) which crystallizes in the space group P21/c with Z=4.
Y. JOURNAUX, J. SLETTEN, O. KAHN
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Thermodynamic investigations of Cu-Dy, Cu-Er, Cu-Gd and Cu-La alloys
Journal of the Less Common Metals, 1986Abstract The heats of formation of intermetallic compounds of copper with dysprosium, erbium, gadolinium and lanthanum have been determined by solution calorimetry in liquid tin at 1100 K. The enthalpy of mixing of the liquid alloys is obtained measuring additionally enthalpy of melting of the compounds.
Ferdinand Sommer +2 more
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Optimal Cu paste thickness for large-area Cu-Cu joint
Materials Letters, 2021Abstract Cu paste has been considered as the most promising die-attach material for high-power devices. To investigate the influences of Cu paste layer thickness on bonding qualities of joint, the large-area joints (10 × 10 mm2) were bonded by multiscale Cu paste with a layer thickness varying from 30 to 200 μm, and the mechanical properties and ...
Lingmei Wu +4 more
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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 2002
Annealing of dilute Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir), and Cu(W) alloy films resulted in the lowest resistivity for Cu(Ti) and Cu(In) and the strongest 〈111〉 fiber texture also for Cu(Ti). Electron-beam evaporated films with compositions in the range of 2.0–4.2 at. % and thicknesses in the range of 420–560 nm were annealed at 400 °C for 5 h.
A. Gungor +4 more
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Annealing of dilute Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir), and Cu(W) alloy films resulted in the lowest resistivity for Cu(Ti) and Cu(In) and the strongest 〈111〉 fiber texture also for Cu(Ti). Electron-beam evaporated films with compositions in the range of 2.0–4.2 at. % and thicknesses in the range of 420–560 nm were annealed at 400 °C for 5 h.
A. Gungor +4 more
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