Results 301 to 310 of about 3,212,901 (332)

Investigation of the H–Cu and Cu–Cu bonds in hydrogenated Cu

Journal of Physics and Chemistry of Solids, 2013
Abstract The pure and hydrogenated copper system CuH n ( n =0, 0.25, 0.50, 0.75 and 1) has been investigated using LCAO-DFT. The average H–Cu (Cu–Cu) bonding interaction increases (decreases) with n whilst concurrent orbital-resolved studies of the H–Cu interactions showed that the (non-)directional H–Cu bonds become more (less) bonding.
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Spectra and energy levels of Cu xxii, Cu xxiii, Cu xxiv, and Cu xxv

Journal of the Optical Society of America B, 1987
Transitions in highly ionized copper in the wavelength range 65-121 A have been identified in spectra recorded at the University of Rochester's 24-beam Omega laser facility. Wavelengths and energy levels are presented for oxygenlike Cu XXII, nitrogenlike Cu XXII, carbonlike Cu XXIV, and boronlike Cu XXV.
J. O. Ekberg, M. C. Richardson, W. E. Behring, J. F. Seely, C. M. Brown, U. Feldman   +5 more
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Homoleptic Cu–phosphorus and Cu–ethene complexes

Chemical Communications, 2007
Stable salts of the first homoleptic Cu-phosphorus and Cu-ethene complexes, [Cu(eta2-P4)2]+ and [Cu(eta2-C2H4)3]+, isolated by the aid of the weakly coordinating anion (WCA) [Al(OC(CF3)3)4]-, were obtained.
Santiso Quiñones, Gustavo, Reisinger, Andreas, Slattery, John, Krossing, Ingo   +3 more
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Self aligned passivation of Cu in Cu/Cr, Cu/V and Cu/Ta multilayers

ICM 2000. Proceedings of the 12th International Conference on Microelectronics. (IEEE Cat. No.00EX453), 2002
We compare Cu/M/SiO/sub 2/ (M=Cr,V and Ta) multilayers that were deposited on Si substrates. Sample resistance measurements were carried out during annealing in 80% N/sub 2/+20% H/sub 2/, N/sub 2/ and Ar environments. Resistivity measurements, SEM observations, RBS and AES spectroscopies from annealed samples showed good diffusion barrier properties ...
A. Iraji-zad, Z. Vashaei, S.M. Mahdavi
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Thin-film interdiffusions in Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films: Correlations of sheet resistance with Rutherford backscattering spectrometries

Journal of Applied Physics, 1991
Interdiffusion in the Cu-based Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films has been investigated for anneal temperatures ranging from 150 to 400 °C in forming gas (N2-10%H2). The diffusion of Pd, Pt, and Ni into Cu has resulted in a significant increase in the sheet resistance of the film, which is correlated with the ...
D.-Y. Shih, C.-A. Chang, J. Paraszczak, S. Nunes, J. Cataldo   +4 more
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Nanoscale Al-Al and Cu-Cu Contacts

TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference, 2007
This paper reports that the forces needed to break Al and Cu native oxide are 0 to 3 muN, and 0 to 0.5 muN, respectively, remarkably less than the previously reported 0.1 N force requirement of breaking Al native oxide. Our modeling and experimental results indicate that nanoscale contact resistance is dominated by local hardening instead of contact ...
Liu, Q, Tien, NC, Roberts, RC, McCormick, DT   +3 more
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?????????????????????????????????? ???????????????? ???????????????????????????? ???????? ?????????????????? ???????????? Ti???Cu ?? Zr???Cu

2009
???????????????? ?????????????????????? ?????????? ???? ?????????????? ?????????????????? ????????????????????? ?? ??????????????????????????? ?? ?????????????????? ???????????????????? 1000???1250 ????. ???????????? ???????????????? ?????? ?????????????????? ???????????? ?????????? ?????????????? ???????????????????? ?????????????? ????????????????????
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Surface effect induced Cu-Cu bonding by Cu nanosolder paste

Materials Letters, 2016
Abstract Based on surface effect of nanoparticles, excellent Cu-Cu bonding was achieved by sintering of Cu nanosolder paste. The surface melting behavior of nanoparticles and the bonding process was investigated at the temperature of 250 °C to 400 °C under the protection of Argon/Hydrogen gas mixtures.
J.J. Li, C.L. Cheng, T.L. Shi, J.H. Fan, X. Yu, S.Y. Cheng, G.L. Liao, Z.R. Tang   +7 more
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Cu-Cu Wiring: The Novel Structure of Cu-Cu Hybrid Bonding

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023
Yoshihisa Kagawa, Takumi Kamibayashi, Nobutoshi Fujii, Shunsuke Furuse, Taichi Yamada, Tomoyuki Hirano, Hayato Iwamoto   +6 more
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Fe/Cu/Fe and Co/Cu/Co multilayers on Cu

IEEE Transactions on Magnetics, 1992
The magnetooptical Kerr effect was used to search for evidence of the oscillatory antiferromagnetic (AF) coupling associated with the recently discovered giant magnetoresistance effect (GMR) in Fe/Cu/Fe and Co/Cu/Co multilayers. The GMR effect was reported in samples grown by magnetron sputtering methods on Si wafers.
W.F. Egelhoff, M.T. Kief
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