Results 211 to 220 of about 11,879,309 (302)

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source

Impact of the Process Atmosphere During Hot Isostatic Pressing on the Near‐Surface Composition of an Additively Manufactured Austenitic High‐Interstitial Steel

Advanced Engineering Materials, EarlyView.
A high interstital austenitic steel is additively manufactured and postdensified by HIP to eliminate gas porosity. Thereby, the loss of N and Mn in Ar HIP atmosphere is investigated. Further, HIP using N2 atmosphere is investigated which led to excessive nitride formation.
F. Großwendt, J. Hahn, J. Kimm, S. Weber, J. Lentz   +4 more
wiley   +1 more source

Elevating CO₂ electrolyzer temperature accelerates the viability of chemical electrification. [PDF]

Nat Chem Eng
Spiekermann L, Lee MG, Wicks J, Peng B, Xie K, Bosetti L, Winter B, Seiler J, Sargent EH, Bardow A.   +9 more
europepmc   +1 more source

Mitigating Creep Anisotropy and Enhancing Performance in Additively Manufactured Ni‐Based Superalloys: A Review

Advanced Engineering Materials, EarlyView.
Additive manufacturing introduces pronounced microstructural and crystallographic anisotropy in Ni‐based superalloys, resulting in orientation‐dependent creep deformation and damage. This review identifies the key microstructural origins of creep anisotropy, examines their influence on dominant deformation mechanisms, and highlights processing ...
Chandan Kumar, Shobhit Pratap Singh, Gaurav Mohanty, Praveen Kumar   +3 more
wiley   +1 more source

Electrodeposition in Structural Lattices of Variable Architectures

Advanced Engineering Materials, EarlyView.
Electrodeposition enables geometry‐sensitive, autonomous void filling while simultaneously tuning chemical and mechanical properties. The development of approaches that can autonomously fill and heal material voids and yield composites with tailorable properties is increasingly relevant in engineering.
Yeong‐Man Kwon, Jingwen Zhang, Guido Musso, Alessandro F. Rotta Loria   +3 more
wiley   +1 more source

Burden of Respiratory Syncytial Virus (RSV) on Severe Acute Respiratory Infection and Projected Cost Offsets of Implementing a Regional Adult RSV Vaccination Programme. [PDF]

Vaccines (Basel)
Townsend L, Bourke TJ, Egwu A, Yap SZK, Howley F, Kent BD, Woods C, Conway A, Crowley B, Kerr C, Kenny RA, Bergin C.   +11 more
europepmc   +1 more source

Microstructural Evolution and In Situ Formation of TiB and TiC in Ti─5Al─2.5Sn Alloy Processed by Powder Metallurgy

Advanced Engineering Materials, EarlyView.
Accelerated in situ formation of TiB and TiC in Ti–5Al–2.5Sn–B4C is driven by transient liquid phase formation, which enhances particle reactions and microstructural evolution. This process increases hardness and establishes a coupled relationship between sintering temperature and reinforcement content, strongly influencing porosity in the resulting ...
Fernando. Y. Kojima, Juliano. Soyama
wiley   +1 more source

Lives saved and financial risk protectionfrom scaling up kangaroo mother care in India: an extended cost -effectivenessanalysis. [PDF]

BMJ Glob Health
Choudhary TS, Mazumder S, Haaland OA, Taneja S, Sommerfelt H, Norheim OF, Bhandari N, Johansson KA.   +7 more
europepmc   +1 more source

Influence of Particle Shape and Size in Copper‐Based Low‐Temperature Metallization Paste for Solar Cells

Advanced Engineering Materials, EarlyView.
Particle morphology controls the balance between printability and electrical connectivity in low‐temperature AgCu/Ag metallization pastes. Flake‐shaped AgCu particles form extended low‐resistance contacts, whereas spherical particles favor processability at high metal loading. Fine Ag particles further tune void filling and conductive‐network formation
O. Mhirsi, M. N. Wengenmeyr, J. Bartsch, B. E. Rapp   +3 more
wiley   +1 more source