Results 281 to 290 of about 892,705 (358)

Improving Surface Quality of Titanium Electrodeposition from a Deep Eutectic Solvent with Organic and Inorganic Additives

open access: yesAdvanced Engineering Materials, EarlyView.
Herein, the electroplating of titanium from an organic solvent, ethaline, is shown. Polymer additives are shown to smooth the roughness of the film, and small molecule additives are shown to produce a near‐mirror finish to the deposited metal. Titanium electroreduction is desired for a variety of medical, electronic, and bonding applications but has ...
Steven Livers   +7 more
wiley   +1 more source

The Structural Refinement of Commercial‐Purity Copper Processed by Equal Channel Angular Pressing with Low Strain Amplitude

open access: yesAdvanced Engineering Materials, EarlyView.
Equal channel angular pressing of commercial pure copper under low strain amplitude (≈0.48) induces concurrent continuous and localized discontinuous dynamic recrystallization, forming a duplex structure influenced by strain heterogeneity and recovery. Moderate hardening after 4–12 passes results from progressive high‐angle grain boundary formation via
Paula Cibely Alves Flausino   +6 more
wiley   +1 more source

Soft Beats: A Dielectric Elastomer‐Based Ventricular Assist Device for Next‐Gen Heart Failure Management

open access: yesAdvanced Engineering Materials, EarlyView.
The dielectric elastomer‐based electropneumatic device (DE‐EPD) is a vacuum‐assisted ventricular assist device (VAD) that delivers high performance (85 mmHg, 6.8 L min−1) with low power consumption. Unlike traditional motor‐driven VADs, it is lightweight, quiet, energy‐efficient, and provides pulsatile flow. Validated in a simulated circulation system,
Amine Benouhiba   +6 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

3D Bioprinting of Thick Adipose Tissues with Integrated Vascular Hierarchies

open access: yesAdvanced Functional Materials, Volume 35, Issue 12, March 18, 2025.
An advanced 3D bioprinting technique is used here to create thick adipose tissues with a central, vessel and extensive branching. The construct is made using alginate, gelatin and collagen‐based bioinks. Flow through the complex vessel network is demonstrated as well as its successful integration with a femoral artery following implantation in a rat ...
Idit Goldfracht   +5 more
wiley   +1 more source

Mechanically Adaptable High‐Performance p(SBMA‐MMA) Copolymer Hydrogel with Iron (II/III) Perchlorate for Wearable Thermocell Applications

open access: yesAdvanced Functional Materials, Volume 35, Issue 12, March 18, 2025.
A high‐performance n‐type element for quasi‐solid‐state thermocells has been introduced, outperforming conventional p‐type elements and showcasing the potential to harness body heat as an energy source or power embedded sensors. This advance significantly contributes to waste thermal energy harvesting and wearable technology, paving the way for self ...
Gilyong Shin   +10 more
wiley   +1 more source

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