Results 281 to 290 of about 22,970,744 (375)
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García +3 more
wiley +1 more source
Plasma electrolytic oxidation is combined with ultrasonic spray deposition of polycaprolactone (PCL) on WE43 magnesium alloy to improve adhesion, corrosion resistance, and cytocompatibility. The hybrid coating demonstrates significantly reduced hydrogen evolution and enhances mechanical bonding, offering a promising strategy for next‐generation ...
Seyed Masih Mousavizadeh +9 more
wiley +1 more source
A framework for constraining image SNR loss due to MR raw data compression. [PDF]
Restivo MC +5 more
europepmc +1 more source
Quantum Data Compression of Ensembles of Mixed States with Commuting Density Operators
Gerhard Kramer, Serap A. Savari
openalex +2 more sources
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke +3 more
wiley +1 more source
Data compression and improved registration for laser speckle contrast imaging of rodent brains. [PDF]
Ringuette D +4 more
europepmc +1 more source
Programmable Reconfiguration of Hybrid 4D Chiral Metamaterials via Mechanical and Thermal Stimuli
A class of hybrid chiral mechanical metamaterials is designed to achieve programmable reconfiguration through soft networks, hinges, and bilayer joints integrated with rigid units. Responsive to mechanical and thermal stimuli, these structures exhibit large volume changes, tunable deformation pathways, and both positive and negative thermal expansion ...
Yunyao Jiang, Siyao Liu, Yaning Li
wiley +1 more source
Energy-Aware Control of Data Compression and Sensing Rate for Wireless Rechargeable Sensor Networks. [PDF]
Yoon I, Noh DK.
europepmc +1 more source
By combining porous, solid, and carbon fiber‐reinforced thermoplastic polyurethane within a single 3D printed honeycomb structure, this current work achieved precise control over spatial stiffness while ensuring strong interlayer adhesion. The findings demonstrate enhanced energy absorption and densification strain, outperforming traditional uniform ...
Savvas Koltsakidis +2 more
wiley +1 more source

