Results 191 to 200 of about 871,220 (308)

Unlocking Terahertz Steganography: Authentication of Hidden Images in Flexible Media

Advanced Materials Technologies, EarlyView.
Hidden information in multilayered devices, such as steganographic portraits, is detected and authenticated using reflection‐mode terahertz time‐domain imaging. Image reconstruction relies on a dedicated figure‐of‐merit obtained by integrating the signal intensity over the time‐window associated with the reflection from the metallic mirror backing the ...
Tiziana Ritacco, Francesca Vittorioso, Dimitrios C. Zografopoulos, Romeo Beccherelli, Walter Fuscaldo   +4 more
wiley   +1 more source

New Step-Up DC/DC Converter for Fuel Cell Powered Distributed Generation Systems: Some Design Guidelines

This paper presents a new step-up DC/DC converter topology to be used for distributed energy systems. The topology contains a voltagefed quasi-Z-source inverter with continuous input current, a high-frequency step-up isolation transformer and a voltage ...
Zaķis, Jānis, Roasto, Indrek, Strzelecki, Ryszard, Vinnikov, Dmitri   +3 more
core  

Machine learning-based MPPT integration with quadratic double-extended DC-DC converter for grid-connected PV-powered BLDC electric vehicles. [PDF]

Sci Rep
Karthikeyan D, Shukla VK, Rajesh K.
europepmc   +1 more source

Hierarchically Wrinkled Silver Ink as a Platform for Fully Integrated Stretchable Electronic Systems

Advanced Materials Technologies, EarlyView.
Silver Hierarchical Responsive ink (SHRink), a universal approach for the fabrication of highly stretchable interconnects, wirings, and skin‐interfaced electrodes, is realized through low‐cost, scalable spray‐printing and transfer‐printing. The SHRink demonstrates high electrical conductivity (1.2E04 S cm−1) and large stretchability (235% max fracture ...
Junye Li, Hao Wang, Xinlei Chen, Mehmet Senel, Patrick Rwei, Sara Marmarchi, David Clymer, Blossom Sundarii Hak‐Khem, Nhi Nguyen, Chengyang Qian, Matt Thomson, Michelle Khine   +11 more
wiley   +1 more source

Digitally Controlled Synchronous Buck-Boost Converter for Ultracapacitor Based Energy Storage Application

This paper presents a synchronous buck-boost DC-DC converter which connects the ultracapacitor pack and a DC bus of an electric vehicle. In order to control this kind of DC-DC converter the digital signal processor (DSP) is used.
Kroičs, Kaspars, Bražis, Viesturs
core  

Cost-effective and versatile Hardware-in-the-Loop system for DC/DC converter emulation in education and research. [PDF]

HardwareX
Gaviria-Cano A, Escudero-Quintero C, López-Suárez JD, Villegas-Ceballos JP, Henao-Bravo EE, Serna-Garcés SI.   +5 more
europepmc   +1 more source

Copper Electroplated TPMS Polymer Lattices for Lightweight Absorption Dominant Electromagnetic Interference Shielding

Advanced Materials Technologies, EarlyView.
Copper electroplating transforms lightweight 3D‐printed TPMS polymer lattices into effective electromagnetic shields. Topology, relative density, and conductive seed layer continuity govern copper penetration, electrical resistance, and attenuation. SEA consistently exceeds SER, while 35% RD Diamond lattice gives the best performance, reaching 48.72 dB
Aman Al Khatib, Fares AlAwwa, Naod Mogos, Abdallah Kamal, Kin Liao, Marwan El Rich, Wael Zaki   +6 more
wiley   +1 more source

Practical Design Guidelines of qZSI Based Step-Up DC/DC Converter

This paper presents some design guidelines for a new voltage fed step-up DC/DC isolated converter. The most significant advantage of proposed converter is voltage buck-boost operation on single stage. The most promising application for proposed converter
Zaķis, Jānis, Roasto, Indrek, Vinnikov, Dmitri, Jalakas, Tanel   +3 more
core  

A novel high-gain isolated quasi Z-source DC-DC converter with self-balancing bipolar outputs. [PDF]

Sci Rep
Heidarbozorg S, Radmanesh H.
europepmc   +1 more source

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

Advanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju, Rumana Hossain, Veena Sahajwalla   +2 more
wiley   +1 more source