Inversion of Soil Parameters and Deformation Prediction for Deep Excavation Based on PSO-SVM Model. [PDF]
Zhao J +6 more
europepmc +1 more source
Micropillar‐Engineered Hybrid Adhesive Patch for Surface‐Conformable and Directional Adhesion
This work presents a surface‐conformable hybrid adhesive integrating height‐optimized hexagonal micropillars with open‐rectangular cuts. The micropillars enhance rough‐surface contact and microscale crack arrest, while the cuts guide and reverse interfacial cracks for strong and directional adhesion. The multiscale architecture achieves robust pull‐off
Seongjin Park +4 more
wiley +1 more source
Research on fault diagnosis method of fiber optic sensing roller driven by dynamic model. [PDF]
Zhang H +7 more
europepmc +1 more source
Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu +8 more
wiley +1 more source
Experimental study of tunnel effects on deformation mitigation in soft clay excavation using centrifuge and PIV. [PDF]
Rui Y, Zhang X, Xue Y, Ren Z.
europepmc +1 more source
Multi‐million cycle reliability for liquid metal stretchable electronics is achieved through a continuous cycle of mechanical testing, failure mode and mechanism analysis and implementing subsequent mitigation strategies. ABSTRACT Stretchable electronics that combine mechanical compliance with reliable electrical performance are essential for ...
Lennert Purnal +8 more
wiley +1 more source
Ultraflexible photoelectrical impedance tomography-based imager for 3-axis robotic tactile sensing. [PDF]
Qiao K +10 more
europepmc +1 more source
Recent Advances of Slip Sensors for Smart Robotics
This review summarizes recent progress in robotic slip sensors across mechanical, electrical, thermal, optical, magnetic, and acoustic mechanisms, offering a comprehensive reference for the selection of slip sensors in robotic applications. In addition, current challenges and emerging trends are identified to advance the development of robust, adaptive,
Xingyu Zhang +8 more
wiley +1 more source
Stability analysis of slope based on the coupling of well-point dewatering and chemical improvement slope stabilization. [PDF]
Chai S +5 more
europepmc +1 more source
Molecular Inks for the Development of Complex 3D In‐Mold Electronics
Molecular inks (MINKs) enable the fabrication of thermoformed 3D circuits by decoupling the forming and metallization steps. Following thermoforming, intense pulsed‑light or thermal processing converts the patterned MINKs into complex 3D conductive tracks with improved stretchability and electrical performance, advancing low‑cost, high‑performance in ...
Mehal P. Kushalkar +14 more
wiley +1 more source

