Results 181 to 190 of about 9,602,956 (245)

Biobanking: IoT, safety challenges and security prospects. [PDF]

open access: yesBMC Med Inform Decis Mak
Diouf A, Malick Diouara AA, Diop I.
europepmc   +1 more source

Rotary 3D Printing With Integrated Electroplating

open access: yesAdvanced Engineering Materials, EarlyView.
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria   +5 more
wiley   +1 more source

Impact of the Process Atmosphere During Hot Isostatic Pressing on the Near‐Surface Composition of an Additively Manufactured Austenitic High‐Interstitial Steel

open access: yesAdvanced Engineering Materials, EarlyView.
A high interstital austenitic steel is additively manufactured and postdensified by HIP to eliminate gas porosity. Thereby, the loss of N and Mn in Ar HIP atmosphere is investigated. Further, HIP using N2 atmosphere is investigated which led to excessive nitride formation.
F. Großwendt   +4 more
wiley   +1 more source

Immature Honey as a Quality Challenge in Global Apicultural Production. [PDF]

open access: yesFoods
Gajda A   +5 more
europepmc   +1 more source

A Multi‐Scale Machine Learning Framework for the Inverse Design of High Entropy Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
High‐entropy alloys offer vast potential for various applications, including electrocatalysis; however, their compositional complexity challenges conventional screening. We introduce an inverse‐design framework combining two neural networks to determine optimal compositions and reconstruct nanoparticle geometry from targeted properties and conventional
Mikael Takoutsin   +14 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

open access: yesAdvanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone   +11 more
wiley   +1 more source

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