Results 181 to 190 of about 1,045,924 (344)
Thermal Resistance of 1D Micron‐Wide Interface Under External Force Modulation
Advanced Materials Interfaces, EarlyView.A novel TET‐based technique is developed to characterize the interfacial thermal resistance at the microscale. The interfacial thermal resistance is measured at ≈1200–1400 mK/W for natural contact. Externally applied force reduces the thermal resistance dramatically down to ≈125 mK/W.
Amin Karamati +3 more
wiley +1 more source
Halide Perovskite Memristor Crossbar Arrays for Low Voltage in Memory Computing
Advanced Materials Interfaces, EarlyView.From early devices to centimeter‐scale crossbars, halide‐perovskite memristors now deliver ultra‐low‐energy, multilevel switching. Yet ion migration, device variability, and sneak currents hinder scaling. Advances in self‐rectifying junctions, nonlinear interfaces, bias maps, and hybrid oxides enhance array stability.
Hyojung Kim
wiley +1 more source
Concept Formation in Expressive Description Logics
, 2004 Nicola Fanizzi +3 more
openalex +1 more source
Goal Representation and Reasoning based on Description Logics(DLs) [PDF]
, 2007 Xiuguo Wu +3 more
openalex +1 more source
Soft Electromagnetic Actuator and Oscillator
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.This work presents a groundbreaking soft electromagnetic system capable of bistable actuation and self‐regulated oscillation. Using liquid metal and silicone as a compliant conductor, the actuator enables force generation, sensing, and feedback with minimal power.
Noah D. Kohls, Yi Chen Mazumdar
wiley +1 more source
A fuzzy description logic based IoT framework: Formal verification and end user programming. [PDF]
PLoS OnePérez-Gaspar M +3 more
europepmc +1 more source
Modeling a description logic vocabulary for cancer research
, 2004 Frank W. Hartel +4 more
openalex +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
Description logics approach to semantic matching of Web services
, 2004 Simona Colucci +4 more
openalex +2 more sources