Results 121 to 130 of about 1,909,618 (298)

Microneedles’ Device: Design, Fabrication, and Applications

Macromol
The delivery of therapeutical molecules through the skin, particularly to its deeper layers, is impaired due to the stratum corneum layer, which acts as a barrier to foreign substances. Thus, for the past years, scientists have focused on the development
Cristiana Oliveira, José A. Teixeira, Nelson Oliveira, Sónia Ferreira, Cláudia M. Botelho   +4 more
doaj   +1 more source

In-situ transfer vat photopolymerization for transparent microfluidic device fabrication. [PDF]

Nat Commun, 2022
Xu Y, Qi F, Mao H, Li S, Zhu Y, Gong J, Wang L, Malmstadt N, Chen Y.   +8 more
europepmc   +1 more source

Regulated Ion‐Diffusion Hydrogels for Subtle and Multimodal Temperature‐Strain Sensing in Wound Monitoring

Advanced Functional Materials, EarlyView.
A soft, dual‐channel hydrogel patch enables simultaneous detection of wound temperature and strain by integrating ion‐diffusion‐mediated thermoelectric and resistive sensing. The conformal design maintains stable performance during motion, capturing subtle inflammatory and mechanical changes for continuous wound monitoring.
Yu Fang, Xinglong Pan, Zhiwei Li, Wanheng Lu, Chang Liu, Yi Zhou, Guo Tian, Ghim Wei Ho   +7 more
wiley   +1 more source

Tailoring inkjet-printed PEDOT:PSS composition toward green, wearable device fabrication. [PDF]

APL Bioeng, 2023
Galliani M, Ferrari LM, Bouet G, Eglin D, Ismailova E.   +4 more
europepmc   +1 more source

Fully Additive Vertical Organic Electrochemical Transistors on Renewable and Compostable Substrates Enable Ultrasensitive Bioelectronics

Advanced Functional Materials, EarlyView.
Fully additive vertical organic electrochemical transistors (vOECTs) with channel‐length of 226 nm on a 50 µm compostable substrate achieve >106 current modulation and ∼36 mS transconductance. Ion‐selective integration enables 1.1 mA dec−1 sensitivity and 36 µm detection limit, highlighting a scalable platform for sustainable electronics and ...
Giulia Frusconi, Samuele Lavelli, Zsolt M. Kovács‐Vajna, Fabrizio Torricelli   +3 more
wiley   +1 more source

Design and fabrication of a MEMS capacitive accelerometer based on double-device-layers SOI wafer

, 2010
This paper presents a capacitive MEMS accelerometer with highly symmetric sandwich structure (Glass-Si-Glass). In order to get highly symmetric beammass structure (silicon middle-layer), a double-device-layer SOI (D-SOI) wafer, which has identical buried
null Yangxi Zhang, Hao, Yilong, Zhang, Dacheng, null Qifang Hu, null Chengchen Gao, null Dacheng Zhang, Hu, Qifang, Yan, Guizhen, null Yilong Hao, Gao, Chengchen, Zhang, Yangxi, null Guizhen Yan   +11 more
core   +1 more source

Integrated microlenses and multimode interference devices for microflow cytometers

, 2010
The convergence of microfabrication technologies, novel materials systems, and techniques for chemical and biochemical analysis is enabling the realisation of lab-on-a-chip technology.
Hunt, Hamish C.
core   +1 more source

Dual Phase Match Turning Point Sensor for Ultra-High Sensitivity Over Large Wavelength Ranges

IEEE Photonics Journal
The sensing capabilities of long-period grating assisted coupling between waveguides on the silicon-on-insulator platform are examined both through dispersion- and guided-wave simulations.
Jens Hovik, Astrid Aksnes
doaj   +1 more source

Omnipolar Magnetic Field Detection by Superlattice‐Based Hall Sensor

Advanced Functional Materials, EarlyView.
Magnetic‐field‐induced electronic switching is demonstrated in unit‐cell‐engineered La0.7Sr0.3MnO3–BiFeO3 superlattices. Distinct substrate terminations modify magnetic and transport properties. Hall resistance measurements show omnipolar, hysteretic anomalous Hall switching above the Curie temperature, arising from Fe─Mn interfacial exchange, enabling
Mark Huijben, Nicolas Gauquelin, Arno Annys, Zhaoliang Liao, Jo Verbeeck, Guus Rijnders, Gertjan Koster   +6 more
wiley   +1 more source

Localized carbon deposition enables trimming of photonic integrated circuits

Nature Communications
Photonic integrated circuits (PICs), widely used in optical communications and computing, require precise post-fabrication trimming due to their high sensitivity to fabrication imperfections.
Rongyang Xu, Zhongyu Tang, Liam McRae, Akhil Varri, Frank Brückerhoff-Plückelmann, Xinyu Ma, Julian Rasmus Bankwitz, Julius Römer, Ravi Pradip, Qinlin Zhang, Lennart Meyer, Zhe Zhao, Jelle Dijkstra, Harish Bhaskaran, Rasmus R. Schröder, Wolfram H. P. Pernice, Shabnam Taheriniya   +16 more
doaj   +1 more source