Results 241 to 250 of about 2,058,154 (316)

A Dislocation Perspective on Strength and Toughness in Ceramics

Advanced Engineering Materials, EarlyView.
Dislocations in ceramics enjoy a long but yet under‐appreciated history. The three research waves for dislocations in ceramics highlight the topic evolution over the last 90 years. This review focuses on the impact of dislocation on strength and toughness in ceramics.
Xufei Fang
wiley   +1 more source

Experimental Characterization of Mycelium‐Based Composites Under Multiple Loading Conditions

Advanced Engineering Materials, EarlyView.
This study examines the mechanical response of mycelium‐based composites under compression, shear, and tension using mechanical testing and imaging methods. The comparison between unpressed and hot‐pressed specimens shows that hot pressing is associated with higher compression and shear stiffnesses.
Shaghayegh Elahi, Kimiya Tajik, Harvey Shaw, Matti Isakov, Sami Pajunen, Lauri Rautkari   +5 more
wiley   +1 more source

Comparative Evaluation of Smartphone-Based Fundus Imaging Systems in Dogs and Cats. [PDF]

Vet Ophthalmol
Michaud B.
europepmc   +1 more source

Reconfigurable Logic‐in‐Memory Operations Enabled by Triple‐Gated Feedback Field‐Effect Transistors for Area‐Efficient Computing

Advanced Engineering Materials, EarlyView.
A reconfigurable logic‐in‐memory cell composed of triple‐gated feedback field‐effect transistors implements multiple combinational logic functions within a single configuration. By utilizing program gates as dynamic input terminals, the proposed cell performs full adder, full subtractor, 2‐to‐1 multiplexer, and 4‐to‐2 encoder operations without ...
Minhyeok Seol, Yunwoo Shin, Donghyung Lee, Dongki Kim, Kyoungah Cho, Sangsig Kim   +5 more
wiley   +1 more source

IoTDI-ImbS: A Precise Identification Model and Algorithm for IoT Devices from Network Traffic. [PDF]

Sensors (Basel)
Qian J, Zhao S, Wang Z, Li Z.
europepmc   +1 more source

Influence of Si Content and Milling Duration on the Microstructure and Mechanical–Tribological Properties of AlCoCrFeNiSi High‐Entropy Alloys

Advanced Engineering Materials, EarlyView.
Si‐doped AlCoCrFeNi high‐entropy alloys are synthesized by mechanical alloying to reveal the effect of Si content and milling time on phase evolution, microstructural refinement, and tribological behavior. A transition from FCC to BCC structure, significant grain refinement, and enhanced hardness and wear resistance are achieved, with the 4 at% Si ...
Mustafa Okumuş, Mehmet Emin Demir, Sercan Özpınar   +2 more
wiley   +1 more source

Electrified Damage in Motion Systems

Advanced Engineering Materials, EarlyView.
The electrified damage in motion systems is a fundamental framework presenting the degradation pathway arising from the coupling of electrical energy transport with mechanical contact and interfacial chemistry. The framework positions electrified damage as a distinct degradation regime with unique characteristic surface morphologies and failures of ...
M. Humaun Kabir, Angelina Nguyen, Hong Liang   +2 more
wiley   +1 more source

Stretching the Printability Metric in Direct‐Ink Writing with Highly Extensible Yield‐Stress Fluids

Advanced Functional Materials, EarlyView.
This study introduces “drawability” as a new metric for assessing printability in direct‐ink writing, focusing on gap‐spanning performance and speed robustness. By designing yield‐stress fluids with high extensibility, we demonstrate that extensional strain‐to‐break significantly enhances printability.
Chaimongkol Saengow, Samya Sen, Joaquin Yus, Eliza E. Lovrich, Amanda G. Hoika, Kelly M. Chang, Arielle A. Pfeil, Nellie Haug, Amy J. Wagoner Johnson, Randy H. Ewoldt   +9 more
wiley   +1 more source

Skin Closure Techniques After Cardiac Implantable Electronic Device Implantation and Their Impact on Pocket Complications: A Systematic Review and Meta-Analysis. [PDF]

Ann Noninvasive Electrocardiol
Mashayekhi Y, Awais M, Hassnat SA, Reji N, Ullah F, Singla B, Singla S, Perveen A, Malik J.   +8 more
europepmc   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source