Experimental Study on the Role of Bond Elasticity and Wafer Toughness in Back Grinding of Single-Crystal Wafers. [PDF]
Yun JC, Lim DS.
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On-Machine Precision Truing and Error Compensation of Cup-Shaped Diamond Grinding Wheels with Arc-Shaped Cutting Edge. [PDF]
Guo Y, Yin Z.
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Experimental Study on Grinding of Inner Raceway of Tapered Roller Bearing Outer Ring. [PDF]
Hou Y, Xu J, Hei Z, Jin G, Gao Y.
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Editor's Choice Articles in the Manufacturing Processes and Systems Section: Emerging Directions in Advanced Manufacturing. [PDF]
Saboori A.
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Characteristics of Pulsed-Laser-Induced Layers with Cracks Prepared for SiC Grinding Processes. [PDF]
Li H, Jiang Y, Yang Y, Yang J, Zhu L.
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Experimental Study on Slicing Sapphire Crystal with Ultrasonic-Assisted Diamond Wire Saw. [PDF]
Ismael F, Sun P, Liu Y, Li H, Gao Y.
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Experimental Analysis of the Correlation Between Cutting Parameters and Recurrence Measures During End Mill Flute Grinding. [PDF]
Kęcik K, Sałata M.
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Machine learning-based prediction of surface quality and tool performance in the grinding of inconel 800. [PDF]
Menon RP +6 more
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Study on Chemical Mechanical Polishing of Single-Crystal Diamond with a Novel Nicotinic Acid-Hydrogen Peroxide Green Slurry. [PDF]
Yi J, Liao L, Fang Y.
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Fabrication Process and Surface Morphology Prediction of Radial Straight Groove-Structured CBN Grinding Wheel by Laser Cladding. [PDF]
Ma Z +7 more
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