Results 81 to 90 of about 1,146 (177)

A low-cost approach to dimple grinding using a rotary tool. [PDF]

MethodsX
Magara H, Morikawa D, Tsuda K.
europepmc   +1 more source

Study on the Mechanism of Chemical-Mechanical Synergistic Removal of SiC Surfaces Based on Electrochemical Friction Wear of Grinding Wheel Pairs. [PDF]

Micromachines (Basel)
Wu L, Chen Z, Ou Y, Yao J, Zhang H, Yan Q, Pan J.   +6 more
europepmc   +1 more source

Formation mechanism of grinding wheel oxide layer in the ultrasonic-assisted ELID grinding of silicon carbide ceramics. [PDF]

Ultrason Sonochem
Jia X, Zhao C, Cao Y, Xu Z, Bao Y, Yin S, Zhao B.   +6 more
europepmc   +1 more source

Editorial for the Special Issue on Advanced Abrasive Processing Technology and Applications. [PDF]

Materials (Basel)
Gao Y.
europepmc   +1 more source

Experimental Study on the Role of Bond Elasticity and Wafer Toughness in Back Grinding of Single-Crystal Wafers. [PDF]

Materials (Basel)
Yun JC, Lim DS.
europepmc   +1 more source

Recent Advances in Precision Diamond Wheel Dicing Technology. [PDF]

Micromachines (Basel)
Chen F, Du M, Feng M, Bao R, Jing L, Hong Q, Xiao L, Liu J.   +7 more
europepmc   +1 more source

On-Machine Precision Truing and Error Compensation of Cup-Shaped Diamond Grinding Wheels with Arc-Shaped Cutting Edge. [PDF]

Micromachines (Basel)
Guo Y, Yin Z.
europepmc   +1 more source

Grinding characteristics of boron doped diamond grits grinding wheel

Proceedings of JSPE Semestrial Meeting, 2006
Iwai, Manabu, Ninomiya, Shinichi, Nakagawa, kiyotaka, Uematsu, Tetsutaro, Suzuki, Kiyoshi   +4 more
openaire   +1 more source

Experimental Study on Grinding of Inner Raceway of Tapered Roller Bearing Outer Ring. [PDF]

Micromachines (Basel)
Hou Y, Xu J, Hei Z, Jin G, Gao Y.
europepmc   +1 more source

Characteristics of Pulsed-Laser-Induced Layers with Cracks Prepared for SiC Grinding Processes. [PDF]

Materials (Basel)
Li H, Jiang Y, Yang Y, Yang J, Zhu L.
europepmc   +1 more source