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The architectural and building journal of Queensland Ltd. : embracing architecture, building and the allied arts [PDF]
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The surface quality of diamond wire sawing (DWS) wafers directly affects the efficiency and yield of subsequent processing steps. This paper investigates the motion trajectory of abrasives in ultrasonic-assisted diamond wire sawing (UADWS) and its ...
Honghao Li +3 more
semanticscholar +1 more source
The surface quality of diamond wire sawing (DWS) wafers directly affects the efficiency and yield of subsequent processing steps. This paper investigates the motion trajectory of abrasives in ultrasonic-assisted diamond wire sawing (UADWS) and its ...
Honghao Li +3 more
semanticscholar +1 more source
International Conference on Microelectromechanical Systems Manufacturing and Materials Technology
This study employed diamond wire-sawn multicrystalline silicon to examine copper salt variations (type/concentration) on surface texturization. Three distinct etching systems controllably produced pit, worm-like, and inverted pyramid nanostructures ...
Yuxin Zou, Huan Liu, Shihao Hong
semanticscholar +1 more source
This study employed diamond wire-sawn multicrystalline silicon to examine copper salt variations (type/concentration) on surface texturization. Three distinct etching systems controllably produced pit, worm-like, and inverted pyramid nanostructures ...
Yuxin Zou, Huan Liu, Shihao Hong
semanticscholar +1 more source
Influence of wire bowing during diamond wire sawing on the surface roughness of crystal wafers
Engineering Research ExpressDiamond wire sawing has become a primary slicing method for certain hard and brittle materials due to its advantages of minimal material loss and high cutting efficiency.
zhishu lin, Jiacheng Yu, Shengbo Li
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Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, 2023
Semiconductor industries have strong demands for innovative techniques and optimum parameters in the machining domain to minimize the cost and environmental footprint during the wafer fabrication process.
Eyob Messele Sefene +2 more
semanticscholar +1 more source
Semiconductor industries have strong demands for innovative techniques and optimum parameters in the machining domain to minimize the cost and environmental footprint during the wafer fabrication process.
Eyob Messele Sefene +2 more
semanticscholar +1 more source
Surface Integrity of Silicon Carbide Machined by Diamond Wire Sawing: Effect of Feed Rate
Anais do Colóquio de UsinagemThis study investigates the influence of feed rate on the surface integrity of silicon carbide (SiC) machined by the diamond wire sawing (DWS) process.
Natalie Souza Heinz +6 more
semanticscholar +1 more source