Results 101 to 110 of about 6,480 (152)

Experimental study on ultrasonic vibration-assisted diamond wire sawing of sic

Journal of Physics: Conference Series
The diamond wire saw, known for its narrow kerf and excellent flexibility, is widely used in the cutting of hard and brittle materials. Additionally, by incorporating an ultrasonic vibration device, the processing efficiency can be significantly enhanced,
Chao Yao, Ligang Zhao, Jiajun Zhu
semanticscholar   +1 more source

Research on the Influence of Alumina Ceramic Microstructure on Diamond Wire Sawing

Integrated Ferroelectrics
Ceramic materials are widely used in national defense, military industry, information technology and other fields, are a typical hard and brittle material. Microstructure and mechanical properties not only affect the overall performance of ceramic parts,
Shujie Wu
semanticscholar   +1 more source

OPTIMIZATION OF OPERATING PARAMETERS OF DIAMOND WIRE SAWING FOR ENHANCING NATURAL STONE EXTRACTION EFFICIENCY

JOURNAL of Donetsk mining institute
Objective. The aim of the study is to improve the efficiency of natural stone cutting processes using diamond wire saw machines in quarries by optimizing operating parameters, particularly current strength.
Yevhenii Syroid, Oleksandr Tolkach, Andrii Sydorenko, Oleksandr Kuznetsov, Dmytrii Bilobrov   +4 more
semanticscholar   +1 more source

Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire

Materials
Electroplated diamond wire sawing is widely used as a processing method to cut hard and brittle difficult-to-machine materials. Currently, obtaining the sawing capability of diamond wire saw through the wire bow is still difficult.
Zixing Yang, Hui Huang, Xinjiang Liao, Zhiyuan Lai, Zhiteng Xu, Yanjun Zhao   +5 more
semanticscholar   +1 more source

Status and perspectives of crystalline silicon photovoltaics in research and industry

Nature Reviews Materials, 2022
Christophe Ballif, Franz-Josef Haug, Mathieu Boccard   +2 more
exaly  

Sawing force modeling and analysis for diamond wire sawing PV monocrystalline silicon considering abrasive wear

Wear
Yufeng Guo, Yufei Gao, Chun-feng Yang
semanticscholar   +1 more source

Modeling and experimental investigation on sawing force in ultrasonic vibration–assisted diamond wire sawing mono-Si considering material removal mode

The International Journal of Advanced Manufacturing Technology
Honghao Li, Yufei Gao, Dameng Cheng, Chun-feng Yang   +3 more
semanticscholar   +1 more source

Wire bow analysis based on process parameters in diamond wire sawing

The International Journal of Advanced Manufacturing Technology, 2023
Yufeng Guo, Yufei Gao, Xingchun Zhang, Zhenyu Shi   +3 more
semanticscholar   +1 more source

Recycling of silicon from waste PV diamond wire sawing silicon powders: A strategy of Na2CO3-assisted pressure-less sintering and acid leaching.

Waste Management, 2023
Qipeng Zou, Liuqing Huang, Weinan Chen, Guangyu Chen, Yan Li, Mengchen Li, Chentong Zhang, Xuetao Luo   +7 more
semanticscholar   +1 more source

Experimental study on surface roughness in ultrasonic vibration–assisted diamond wire sawing monocrystalline silicon

The International Journal of Advanced Manufacturing Technology
Honghao Li, Yufei Gao, Dameng Cheng, Chun-feng Yang   +3 more
semanticscholar   +1 more source