An Ultra-Low-Power Oscillator with Temperature and Process Compensation for UHF RFID Transponder [PDF]
This paper presents a 1.28MHz ultra-low-power oscillator with temperature and process compensation. It is very suitable for clock generation circuits used in ultra-high-frequency (UHF) radio-frequency identification (RFID) transponders. Detailed analysis
Liu, J., Wang, Y., Wen, G., Xie, L.
core +1 more source
Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits (Through Die Extraction, Electroless Nickel/Gold Pad Reconditioning, and Ceramic Re-Assembly) [PDF]
Erick M. Spory
openalex +1 more source
Chemically Processed Porous V2O5 Thin‐Film Cathodes for High‐Performance Thin‐film Zn‐Ion Batteries
This study presents a rapid, cost‐effective chemical method for fabricating porous vanadium oxide thin‐film cathodes, aimed at enhancing charge storage in Zinc‐ion thin‐film batteries. The approach promises high‐performance, safe, and affordable thin‐film batteries, with industrial viability through efficient processing of highly porous cathodes ...
Jingli Luo+9 more
wiley +1 more source
Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages [PDF]
B. K. Tanner+4 more
openalex +1 more source
Wearable Haptic Feedback Interfaces for Augmenting Human Touch
The wearable haptic feedback interfaces enhance user experience in gaming, social media, biomedical instrumentation, and robotics by generating tactile sensations. This review discusses and categorizes current haptic feedback interfaces into force, thermal, and electrotactile stimulation‐based haptic feedback interfaces, elucidating their current ...
Shubham Patel+3 more
wiley +1 more source
Experimental Research of the Usability on Double Acting Intensifiers in Hydroforming
The hydroforming method is especially used for forming lightweight materials like aluminum, magnesium alloys, high strength steels or materials that have limited formability. Intensifiers are the most important component of hydroforming presses. Nowadays
Günaydın Ahmet Can+3 more
doaj +1 more source
Laser sources on a heterogeneous III-V/silicon platform [PDF]
The heterogeneous integration of III-V semiconductor lasers on a silicon waveguide platform using DVS-BCB adhesive bonding is reviewed.
Baets, Roel+13 more
core
The Emerging 4D Printing of Shape‐Memory Thermomorphs for Self‐Adaptative Biomedical Implants
4D printing enables the creation of smart implants that adapt to changing conditions in the human body over time. At the core of this technology are shape‐memory thermomorphs (SMTMs). This review offers an in‐depth analysis of 4D printing with SMTMs, emphasizing the latest advancements in smart materials, stimuli, programming principles, and their ...
Aixiang Ding, Fang Tang, Eben Alsberg
wiley +1 more source
Innovative Hardware Accelerator Architecture for FPGA-Based General-Purpose RISC Microprocessors
Reconfigurable computing (RC) theory aims to take advantage of the flexibility of general-purpose processors (GPPs) alongside the performance of application specific integrated circuits (ASICs).
Ehsan Ali
doaj +1 more source
This paper presents a D-band 16-element phased-array transceiver IC with integrated dual-polarized antenna for 6G wireless communications. Fabricated in 28-nm CMOS, the transceiver operates with five component carriers (5CCs) supporting carrier ...
Hyohyun Nam+13 more
doaj +1 more source