An Ultra-Low-Power Oscillator with Temperature and Process Compensation for UHF RFID Transponder [PDF]
, 2013 This paper presents a 1.28MHz ultra-low-power oscillator with temperature and process compensation. It is very suitable for clock generation circuits used in ultra-high-frequency (UHF) radio-frequency identification (RFID) transponders. Detailed analysis
Liu, J., Wang, Y., Wen, G., Xie, L.
core +1 more source
Planar Solid‐State Nanopores Toward Scalable Nanofluidic Integration Based on CMOS Technology
Advanced Engineering Materials, EarlyView.We present a scalable silicon‐based fabrication strategy for planar solid‐state nanopores to enable their integration with complex nanofluidic systems. Prototype devices demonstrate normal voltage‐current characteristics, good noise performance, and appreciable streaming currents. Our CMOS‐compatible fabrication process offers precise geometric control
Ngan Hoang Pham +7 more
wiley +1 more source
A Manufacturer Design Kit for Multi-Chip Power Module Layout Synthesis [PDF]
, 2017 The development of Multi-Chip Power Modules (MCPMs) has been a key factor in recent advancements in power electronics technologies. MCPMs achieve higher power density by combining multiple power semiconductor devices into one package.
Main, Jonathan
core +2 more sources
A Compact Spin‐Coated Graphene UWB Antenna for Breast Tumor Detection
Advanced Engineering Materials, EarlyView.A compact, spin‐coated graphene ultra‐wideband patch antenna designed for breast tumor detection, capable of distinguishing between malignant and benign tumors. This innovative antenna can serve as an effective initial screening tool, particularly in resource‐limited settings such as rural areas, where access to advanced medical equipment like MRI and ...
Raja Rashidul Hasan +9 more
wiley +1 more source
Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits (Through Die Extraction, Electroless Nickel/Gold Pad Reconditioning, and Ceramic Re-Assembly) [PDF]
, 2015 Erick M. Spory
openalex +1 more source
Advanced Engineering Materials, EarlyView.High‐frequency (HF) welding of steel is limited by oxide inclusions that degrade weld quality. This study demonstrates, for the first time, the integration of a nonthermal Ar/H2 dielectric barrier discharge (DBD) plasma jet into HF welding. Local plasma treatment provides effective shielding and in‐situ oxide reduction, resulting in markedly fewer and ...
Viktor Udachin +4 more
wiley +1 more source
Assessment of the Immunity of Unshielded Multicore Integrated Circuits to Near Field Injection [PDF]
, 2009 International audienceThis paper presents a comparative assessment of the electromagnetic immunity of 4 integrated logic cores to near-field injection.
Alaeldine, Ali +6 more
core +3 more sources
Handbook of Establishing and Maintaining Oxygen‐Free Atmospheres
Advanced Engineering Materials, EarlyView.This study presents a practical framework for creating oxygen‐free atmospheres at ambient pressure using silane‐doped inert gases. The results show that ultra‐low oxygen levels and strongly reduced water content can be achieved through controlled silane dosing, drying systems, and sensor monitoring.
Sascha Jan Zimmermann +3 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.A hierarchical porous copper current collector is fabricated via three‐dimensional printing combined with pressureless sintering to stabilize lithium metal anodes. The interconnected architecture lowers local current density, guides uniform Li deposition within pores, and suppresses dendrite growth.
Alok Kumar Mishra, Mukul Shukla
wiley +1 more source
High-Throughput Multiple Dies-to-Wafer Bonding Technology and III/V-on-Si Hybrid Lasers for Heterogeneous Integration of Optoelectronic Integrated Circuits [PDF]
, 2015 Xianshu Luo +11 more
openalex +1 more source