Results 181 to 190 of about 127,361 (299)
Predicting Thermal Resistance of Packaging Design by Machine Learning Models. [PDF]
Lai JP+5 more
europepmc +1 more source
Unravelling charge transport mechanisms in graphene nanosheet networks: by combining temperature‐dependent conductivity measurements with a Random Resistor Network model, this study identifies a transition from hopping‐dominated conduction to a band‐like transport mechanism.
Alessandro Grillo+9 more
wiley +1 more source
Programmable multifunctional integrated microwave photonic circuit on thin-film lithium niobate. [PDF]
Wei C+8 more
europepmc +1 more source
HKUST‐1/TiO2 composite materials show a very high photocatalytic hydrogen evolution rate which increases as a function of the irradiation time until reaching a plateau and even surpasses the performance of the 1%Pt/TiO2 material after three photocatalytic cycles.
Alisha Khan+9 more
wiley +1 more source
Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review. [PDF]
Chen G, Wang G, Wang Z, Wang L.
europepmc +1 more source
Ozone‐based gas‐phase metal‐assisted chemical etching enables unprecedented room‐temperature fabrication of high‐quality silicon nanowires. The superior oxidation potential of O3 drives rapid vertical etching (1 µm min−1) while maintaining exceptional structural integrity. The pristine nanowire surfaces enable high‐performance core‐shell photodetectors
Hyein Cho+11 more
wiley +1 more source
A miniaturized MEMS accelerometer with anti-spring mechanism for enhancing sensitivity. [PDF]
Xiong R+6 more
europepmc +1 more source
Ternary Transistors With Reconfigurable Polarities
Polarity‐reconfigurable ternary transistors are demonstrated using black phosphorus homojunction with asymmetric contacts and split‐gate structures. Suppression of majority carrier injection, while Fowler–Nordheim tunneling of low‐density minority carriers persists, enables a well‐defined intermediate state with improved on/off ratios.
Dongju Yeom+11 more
wiley +1 more source
Identification and Evolution of Core Technologies in the Chip Field Based on Patent Networks. [PDF]
Wang Y, Chen R, Chen J.
europepmc +1 more source