Results 201 to 210 of about 366,258 (347)
MOFs and COFs in Electronics: Bridging the Gap between Intrinsic Properties and Measured Performance
Metal‐organic frameworks (MOFs) and covalent organic frameworks (COFs) hold promise for advanced electronics. However, discrepancies in reported electrical conductivities highlight the importance of measurement methodologies. This review explores intrinsic charge transport mechanisms and extrinsic factors influencing performance, and critically ...
Jonas F. Pöhls, R. Thomas Weitz
wiley +1 more source
Electrostatic anti-spring-enhanced MEMS accelerometer with auto-tuning capability. [PDF]
Wang C +10 more
europepmc +1 more source
Sucrose‐derived porous carbon network (SPINE‐C) is formed within CNT fibers via FCCVD, bridging inter‐bundles of CNTs and increasing surface area through introduced microporosity. As a result, both mechanical and electrochemical properties are simultaneously enhanced, leading to a 2.8‐fold increase in the power density of a mechano‐electrochemical ...
Hocheol Gwac +9 more
wiley +1 more source
Flexible Hybrid Integration Hall Angle Sensor Compatible with the CMOS Process. [PDF]
Luo Y, Fang Y, Lv Y, Zheng H, Guan K.
europepmc +1 more source
Highly Selective Toward HER or CO2RR by Regulating Cu Single and Dual Atoms on g‐C3N4
This systematic study provides insights into the design of electrocatalysts for hydrogen evolution reaction (HER) and carbon dioxide reduction (CO2RR). It serves as a useful guide for tuning catalyst architecture toward efficient multifunctional performance by varying synthetic parameters, demonstrating the impact of copper (Cu) species ranging from ...
Wan‐Ting Chen +9 more
wiley +1 more source
Device Integration Technology for Practical Flexible Electronics Systems
Flexible device integration technologies are essential for realizing practical flexible electronic systems. In this review paper, wiring and bonding techniques critical for the industrial‐scale manufacturing of wearable devices are emphasized based on flexible electronics.
Masahito Takakuwa +5 more
wiley +1 more source
Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips. [PDF]
Li X +5 more
europepmc +1 more source
A solid‐state ion exchange strategy constructs dentrimental Li2CO3 into a high‐modulus, high‐surface‐energy interface to enable dendrite‐free deposition of Li metal anode in the harsh carbonate‐based electrolyte. Abstract The practical application of lithium metal batteries (LMBs) in carbonate‐based electrolytes is hindered by uncontrolled lithium (Li)
Qiannan Zhao +5 more
wiley +1 more source
Integrated chips: An interdisciplinary evolution in the Post-Moore Era. [PDF]
Sun N, Liu M.
europepmc +1 more source
This study investigates electromechanical PUFs that improve on traditional electric PUFs. The electron transport materials are coated randomly through selective ligand exchange. It produces multiple keys and a key with motion dependent on percolation and strain, and approaches almost ideal inter‐ and intra‐hamming distances.
Seungshin Lim +7 more
wiley +1 more source

