Results 231 to 240 of about 260,602 (285)

Illuminating the Origins of Ferroelectric‐Induced Photocurrent and Hole Lifetime Enhancement in BaTiO3 Photoanodes

Advanced Functional Materials, EarlyView.
The use of ferroelectric polarization to enhance photocatalytic and photoelectrocatalytic activity is an innovative, and increasingly studied route to improve the spatial separation of charge carriers and therefore enhance catalytic efficiency. These results demonstrate how the intrinsic properties of a ferroelectric film can extend charge carrier ...
Chloe Forrester, Adriana Augurio, Charlie Henderson, Ji‐Seon Kim, James R. Durrant, Joe Briscoe   +5 more
wiley   +1 more source

Kidney replacement therapy during extracorporeal membrane oxygenation: pathophysiology, technical considerations, and outcomes. [PDF]

Ren Fail
Lau MPXL, Ling RR, Ong BJA, Cho HJ, Jeong IS, Sahoo TK, Chua HR, Shekar K, Ramanathan K.   +8 more
europepmc   +1 more source

Integrated Precision High-Frequency Signal Conditioner for Variable Impedance Sensors. [PDF]

Sensors (Basel)
Brkić M, Radić J, Babković K, Damnjanović M.   +3 more
europepmc   +1 more source

Printed circuit board substrates derived from lignocellulose nanofibrils for sustainable electronics applications. [PDF]

Sci Rep
Dudnyk Y, Kulha P, Procházka V, Nyström G, Geiger T.   +4 more
europepmc   +1 more source

A 3.584 Tbps coherent receiver chip on InP-LiNbO₃ wafer-level integration platform. [PDF]

Light Sci Appl
Xie X, Wei C, He X, Chen Y, Wang C, Sun J, Jiang L, Ye J, Zou X, Pan W, Yan L.   +10 more
europepmc   +1 more source

GaN HEMTs-based compact power factor corrected 96.1% peak efficiency LED driver with gate assisted circuit. [PDF]

Sci Rep
Faizan M, Qian Z, Zhu H, Fan S, Yousaf MZ, Bajaj M, Zhichu C, Aziz A.   +7 more
europepmc   +1 more source

A Pathway for the Integration of Novel Ferroelectric Thin Films on Non-Planar Photonic Integrated Circuits. [PDF]

Micromachines (Basel)
Lievens E, De Geest K, Picavet E, Van Landschoot L, Vrielinck H, Feutmba GF, Rijckaert H, De Buysser K, Van Thourhout D, Bienstman P, Beeckman J.   +10 more
europepmc   +1 more source

Thermal Effect of TSVs in 3D Die-Stacked Integrated Circuits

2011 14th Euromicro Conference on Digital System Design, 2011
Shorter interconnects and higher integration are among the benefits that 3D die-stacking is expected to bring to future integrated circuits. However, when stacking power-dissipating dies one on top of the other, the total power density increases accordingly. As a result, temperatures in 3DICs are exacerbated.
Hadrien A. Clarke, Kazuaki Murakami
openaire   +3 more sources

"The Reliability of Epoxy as a Die Attach in Digital and Linear Integrated Circuits"

12th International Reliability Physics Symposium, 1974
The implementation and advantages of epoxy die-attach are described with special emphasis given to areas of mechanical integrity and product stability. A recent special test program indicates that the epoxy die-attach process results in reliable product.
Bernard M. Pietrucha, Eugene M. Reiss
openaire   +3 more sources