Results 231 to 240 of about 366,258 (347)

An RFID-Inspired One-Step Packaged Multimode Bio-Analyzer with Vacuum Microfluidics for Point-of-Care Diagnostics. [PDF]

Dig Tech Pap IEEE Int Solid State Circuits Conf
Hsiao YT, Tsai YC, Foo W, Hou HY, Su YC, Li YL, Chien JC.   +6 more
europepmc   +1 more source

Coupled Ferroelectric–Photoelectrochemical in Water Reduction Over BiFeO3 Thin Film Heterostructure Modulated by Rare‐Earth Doping

Advanced Functional Materials, EarlyView.
Gd‐doped BFO (BGFO) exhibits a ∼2‐order reduction in leakage current owing to its lowest content of oxygen vacancies. This leads to a ∼2.5‐fold increase in remnant polarization. These improvements in BGFO effectively boost charge separation and transportation, resulting in the greatest incident photon‐to‐current efficiency of 12.9 ± 0.73% and a ∼1.5 ...
Ming‐Wei Chu, Narong Chanlek, Cheng‐Sao Chen, Pin‐Yi Chen, Kuei‐Chih Feng, Chi‐Shun Tu, Chang Fu Dee, Wei Sea Chang   +7 more
wiley   +1 more source

Integrated microoptical system for continuous fluorescence monitoring of microtissues. [PDF]

Microsyst Nanoeng
Tian X, Kavand H, Köhler M, Jessika J, Gjaci R, Visa M, Berggren PO, Stemme G, van der Wijngaart W, Herland A, Roxhed N.   +10 more
europepmc   +1 more source

Room‐Temperature, High‐Resolution Soft Anisotropic Conductive Film for Electrical Interfacing in Stretchable Electronics

Advanced Functional Materials, EarlyView.
A UV‐crosslinkable soft anisotropic conductive film (ACF) provides high‐resolution, room‐temperature electrical interfacing. Upon UV exposure, azide crosslinkers within the ACF matrix form covalent bonds with a wide range of C–H‐containing materials, resulting in interfaces that are both mechanically durable and electrically reliable.
Jun Choi, Hyundong Nam, Doowon Park, Woosung Cho, Mingyu Kwak, Taeyeong Kim, Ik‐Soo Kim, Unyong Jeong   +7 more
wiley   +1 more source

A neuromorphic processor with on-chip learning for beyond-CMOS device integration. [PDF]

Nat Commun
Greatorex H, Richter O, Mastella M, Cotteret M, Klein P, Fabre M, Rubino A, Soares Girão W, Chen J, Ziegler M, Bégon-Lours L, Indiveri G, Chicca E.   +12 more
europepmc   +1 more source

Region‐to‐Region Unidirectional Connection In Vitro Brain Model for Studying Directional Propagation of Neuropathologies

Advanced Functional Materials, EarlyView.
A unidirectional cerebral organoid–organoid neural circuit is established using a microfluidic platform, enabling controlled directional propagation of electrical signals, neuroinflammatory cues, and neurodegenerative disease–related proteins between spatially separated organoids.
Kyeong Seob Hwang, Hui‐Wen Liu, Hyogeun Shin, Hyun Wook Kang, Minjin Kang, Jongbaeg Kim, Il‐Joo Cho, Nakwon Choi, Seok Chung, Hong Nam Kim   +9 more
wiley   +1 more source

Reconfigurable Metamirrors Based on Compliant Mechanisms

Advanced Functional Materials, EarlyView.
Providing the basis for numerous practical applications, the reconfigurability of metadevices is of great importance. Through the integration of controlled mechanical deformation with chiral meta‐atoms, a compliant mechanism based metamirror is demonstrated for active control over the polarization of electromagnetic waves.
Galestan Mackertich‐Sengerdy, Lei Kang, Sawyer D. Campbell, Douglas H. Werner   +3 more
wiley   +1 more source

Using Embedded Temperature Sensors to Detect Package Tampering. [PDF]

Sensors (Basel)
Chancel G, Toulemont J, Mailly F, Maurine P, Nouet P.   +4 more
europepmc   +1 more source

Complementary Logic Driven by Dielectrophoretic Assembly of 2D Semiconductors

Advanced Functional Materials, EarlyView.
Scalable, parallel fabrication of complementary logic gates is demonstrated using electric‐field‐driven deterministic assembly of electrochemically exfoliated 2D n‐type MoS2 and p‐type WSe2 nanosheets. This strategy yields MoS2 and WSe2 transistors featuring average mobilities of 4.3 and 3.0 cm2 V−1 s−1, respectively, and on/off ratios of > 104 ...
Dongjoon Rhee, Okin Song, Ji Yun Park, Yonghyun Albert Kwon, Jae Hyung Kim, In Soo Kim, Zdeněk Sofer, Jeong Ho Cho, Deep Jariwala, Hyesung Park, Joohoon Kang   +10 more
wiley   +1 more source

Compression Molding Flow Behavior and Void Optimization of an Integrated Circuit Package with Shielding-Metal-Frame. [PDF]

Polymers (Basel)
Lee TY, Chen YL, Hwang SJ, Cheng WL, Ko CY.   +4 more
europepmc   +1 more source