Results 231 to 240 of about 135,051 (299)

Fluorine‐Free Soft Nanocomposites for High‐Speed Liquid Impact Repellence

Advanced Functional Materials, EarlyView.
Fluorine‐free soft nanocomposite coatings are developed using silicone oil‐mediated mechanical‐stiffness control, enabling ‘dry’ liquid‐repellent surfaces that resist high‐speed water jet impacts up to ∼60 m/s. By tuning nanoparticle loading and oil content, the coatings also achieve >90% optical transparency, amphiphobicity with impact resistance to ...
Priya Mandal, Vikramjeet Singh, Rohit Gupta, Prasenjit Kabi, Manish K. Tiwari   +4 more
wiley   +1 more source

A CMOS Hybrid System for Non-Invasive Hemoglobin and Oxygen Saturation Monitoring with Super Wavelength Infrared Light Emitting Diodes. [PDF]

Micromachines (Basel)
Park H, Kang S, Kim J, Lee J, Park S, Park SM.   +5 more
europepmc   +1 more source

Integrated Circuits on Fiber Substrates: State-of-the-Art System-on-Fiber Technologies for Smart Textiles and Wearables. [PDF]

Nanomicro Lett
Jin J, Won J, Kim D, Arumugasamy SK, Park S, Kim TW.   +5 more
europepmc   +1 more source

A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications. [PDF]

Adv Sci (Weinh)
Qin W, Li S, Wei W, Bai H, Jia S, Landers RG, Ma Y, Wei S, Kang T, Zhang M, Zhang W, Wang M, Guan T.   +12 more
europepmc   +1 more source

NEO-PGA: Nonvolatile electro-optically programmable gate array. [PDF]

Sci Adv
Chen R, Tang A, Dutta J, Tara V, Ye J, Fang Z, Majumdar A.   +6 more
europepmc   +1 more source

Wide-Dynamic-Range Lead-Free SWIR Image Sensors Based on InAs Thin-Film Quantum-Dot Photodiodes ^†. [PDF]

Sensors (Basel)
Chu M, Song W, Kim JH, Weydts T, Pejovic V, Lee J, Jin M, Lee SY, Seo Y, Yoo H, Bentell J, Siddik AB, Monroy IP, Vildanova M, Zaman AU, Yoo TJ, Malainou A, Hussein W, Spagnolo A, Karve G, Lieberman I, Guerrieri S, Malinowski PE.   +22 more
europepmc   +1 more source

Compression Molding Flow Behavior and Void Optimization of an Integrated Circuit Package with Shielding-Metal-Frame. [PDF]

Polymers (Basel)
Lee TY, Chen YL, Hwang SJ, Cheng WL, Ko CY.   +4 more
europepmc   +1 more source

Some of the next articles are maybe not open access.

Related searches:

Novel technology of III-V die-bonded SOI photonic integrated circuits

Emerging Applications in Silicon Photonics II, 2021
In the frame of the H2020 PICTURE project, we designed and developed densely integrated photonic devices and transceiver (TRx) circuits for high bit-rate telecom and datacom applications. We implemented a process with four different InP-based dies bonded on SOI wafers.
Delphine Néel, Alexandre Shen, Pierre Fanneau de La Horie, Nicolas I. Vaissière, Arnaud Wilk, Viviane Muffato, Stéphane Malhouitre, Valentin Ramez, Yohan Desières, Karim Hassan   +9 more
openaire   +1 more source