Results 81 to 90 of about 127,361 (299)

Advances in Hybrid Icing and Frosting Protection Strategies for Optics, Lens, and Photonics in Cold Environments Using Thin‐Film Acoustic Waves

Advanced Engineering Materials, EarlyView.
This article provides a comprehensive overview of fundamentals and recent advances of transparent thin‐film surface acoustic wave technologies on glass substrates for monitoring and prevention/elimination of fog, ice, and frost. Fogging, icing, or frosting on optical lenses, optics/photonics, windshields, vehicle/airplane windows, and solar panel ...
Hui Ling Ong, Zhangbin Ji, Luke Haworth, Yihao Guo, Jaime del Moral, Stefan Jacob, Ana Borras, Agustin R. Gonzalez‐Elipe, Jikai Zhang, Jian Zhou, Glen McHale, Yong‐Qing Fu   +11 more
wiley   +1 more source

High‐Rate Deposition and Characterization Study of CoZrO Films for On‐Chip Power Applications

Advanced Engineering Materials, EarlyView.
This study introduces a high‐rate reactive sputtering process for CoZrO films, aimed at large‐scale production of on‐chip magnetic components compatible with complementary metal oxide semiconductor (CMOS) fabrication. Characterization of the deposited films reveals that ideal magnetic properties require chemical compositions in a narrow Co:O range and ...
Elaine Ng, Leopoldo A. Hernandez, Jianliang Lin, Elizabeth Young‐Dohe, Charles R. Sullivan, Alex J. Hanson, Jean Anne C. Incorvia   +6 more
wiley   +1 more source

An Examination of Aerosol Jet‐Printed Surface Roughness and its Impact on the Performance of High‐Frequency Electronics

Advanced Engineering Materials, EarlyView.
This study explores aerosol jet‐printed (AJP) surface roughness, its effects on the performance of microwave electronics, and its process contributors. First, an electromagnetic model is vetted for AJP's unique roughness signature. Simulations are built which show process‐induced roughness is as significant as conductor resistivity in driving microwave
Christopher Areias, Alkim Akyurtlu
wiley   +1 more source

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Micromachines, 2019
Fan-out wafer level packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and ...
Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker, Martin Schneider-Ramelow   +6 more
doaj   +1 more source

New Developments in the Field of Production and Application of Multi‐Material Wire Arc Additive Manufacturing Components: A Review

Advanced Engineering Materials, EarlyView.
The utilization of direct energy deposition (DED)‐arc additive manufacturing processes in industrial applications is increasing, and these processes have the potential for multi‐material applications. This work provides a overview of the state of research in DED‐arc made functional graded structures, to establish a link to potential industrial ...
Kai Treutler, Volker Wesling
wiley   +1 more source

Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process

Applied Sciences, 2019
The electronics industry in Taiwan has achieved a complete information and communication technology chain with a firm position in the global electronics industry.
Chun-Ming Yang, Kuo-Ping Lin, Kuen-Suan Chen   +2 more
doaj   +1 more source

High‐Resolution Reverse Offset Printed Electroluminescent Multipixel Arrays for Scalable Future Wearable Displays

Advanced Engineering Materials, EarlyView.
This study explores the effects of pixel size and spacing when fabricating electroluminescent (EL) multipixel displays. COMSOL simulations identify the impact of pixel dimensions and spacing on electric field distribution and lighting efficiency. Flexible, high‐resolution EL pixel arrays are reverse offset printed, achieving a 96% reduction in pixel ...
Huanghao Dai, Yuxin Xia, Steve Beeby, Russel Torah   +3 more
wiley   +1 more source

Ultra-low-power CMOS ring oscillator with minimum power consumption of 2.9 pW using low-voltage biasing technique

Open Engineering
The need for low-power low-voltage circuit so lutions increases significantly with the rapid spread of wireless sensor network (WSN) and energy harvesting applications.
Al-Shebanee Durgham
doaj   +1 more source

Room temperature operated HgCdTe colloidal quantum dot infrared focal plane array using shockwave dispersion technique

Applied Surface Science Advances, 2020
This paper reports development and performance evaluation of room temperature operated Mercury Cadmium Telluride (HgCdTe) colloidal quantum dot (CQD) coated Si Readout Integrated Circuit (ROIC) based Infrared (IR) Focal Plane Array (FPA).
Abhijit Chatterjee, Janani Balakrishnan, Naresh Babu Pendyala, K.S.R. Koteswara Rao   +3 more
doaj  

Key Trends and Insights in Smart Polymeric Skin Wearable Patches

Advanced Engineering Materials, EarlyView.
Intelligent polymers, which respond to various physical and biological stimuli, are explored for the development of skin wearable patches in biomedical applications. Smart polymers, also known as intelligent or stimuli‐responsive polymers, play a crucial role in the development of advanced wearable patches due to their versatility and softness.
Sergio J. Peñas‐Núñez, Rajat Rai, Miryam Criado‐Gonzalez   +2 more
wiley   +1 more source