Results 81 to 90 of about 124,738 (302)

Advances in Hybrid Icing and Frosting Protection Strategies for Optics, Lens, and Photonics in Cold Environments Using Thin‐Film Acoustic Waves

Advanced Engineering Materials, EarlyView.
This article provides a comprehensive overview of fundamentals and recent advances of transparent thin‐film surface acoustic wave technologies on glass substrates for monitoring and prevention/elimination of fog, ice, and frost. Fogging, icing, or frosting on optical lenses, optics/photonics, windshields, vehicle/airplane windows, and solar panel ...
Hui Ling Ong, Zhangbin Ji, Luke Haworth, Yihao Guo, Jaime del Moral, Stefan Jacob, Ana Borras, Agustin R. Gonzalez‐Elipe, Jikai Zhang, Jian Zhou, Glen McHale, Yong‐Qing Fu   +11 more
wiley   +1 more source

ALD‐Assisted VO2 for Memristor Application

Advanced Engineering Materials, EarlyView.
This work demonstrates a strategy for depositing VOx using thermal atomic layer deposition (ALD) followed by thermal annealing to synthesize VO2. The thin film and core/shell wire memristors exhibit excellent switching performance and are highly sensitive to ambient temperature.
Jun Peng, Daniel Hensel, Rakshith Venugopal, Lucas Rave, Colin Schormann, Sebastian Koch, Robert H. Blick, Robert Zierold   +7 more
wiley   +1 more source

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Micromachines, 2019
Fan-out wafer level packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and ...
Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker, Martin Schneider-Ramelow   +6 more
doaj   +1 more source

A High-Temperature, High-Voltage SOI Gate Driver Integrated Circuit with High Drive Current for Silicon Carbide Power Switches [PDF]

, 2010
High-temperature integrated circuit (IC) design is one of the new frontiers in microelectronics that can significantly improve the performance of the electrical systems in extreme environment applications, including automotive, aerospace, well-logging ...
Huque, Mohammad Aminul
core   +1 more source

An Examination of Aerosol Jet‐Printed Surface Roughness and its Impact on the Performance of High‐Frequency Electronics

Advanced Engineering Materials, EarlyView.
This study explores aerosol jet‐printed (AJP) surface roughness, its effects on the performance of microwave electronics, and its process contributors. First, an electromagnetic model is vetted for AJP's unique roughness signature. Simulations are built which show process‐induced roughness is as significant as conductor resistivity in driving microwave
Christopher Areias, Alkim Akyurtlu
wiley   +1 more source

Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process

Applied Sciences, 2019
The electronics industry in Taiwan has achieved a complete information and communication technology chain with a firm position in the global electronics industry.
Chun-Ming Yang, Kuo-Ping Lin, Kuen-Suan Chen   +2 more
doaj   +1 more source

Microstructure, Mechanical Properties, and Antibacterial Performance of Novel Fe‐Mn‐Zn Nanocrystalline Alloys Produced by Mechanical Alloying

Advanced Engineering Materials, EarlyView.
This article presents the development of Fe‐Mn‐Zn nanocrystalline alloys (0–9 wt% Zn) by mechanical alloying and subsequently hot pressing. Their microstructure, density, hardness, wear resistance, corrosion behavior, and antibacterial properties are systematically examined.
Ilker Emin Dag, Funda Kilic, Mrutyunjay Panigrahi, Baris Avar   +3 more
wiley   +1 more source

Ultra-low-power CMOS ring oscillator with minimum power consumption of 2.9 pW using low-voltage biasing technique

Open Engineering
The need for low-power low-voltage circuit so lutions increases significantly with the rapid spread of wireless sensor network (WSN) and energy harvesting applications.
Al-Shebanee Durgham
doaj   +1 more source

Room temperature operated HgCdTe colloidal quantum dot infrared focal plane array using shockwave dispersion technique

Applied Surface Science Advances, 2020
This paper reports development and performance evaluation of room temperature operated Mercury Cadmium Telluride (HgCdTe) colloidal quantum dot (CQD) coated Si Readout Integrated Circuit (ROIC) based Infrared (IR) Focal Plane Array (FPA).
Abhijit Chatterjee, Janani Balakrishnan, Naresh Babu Pendyala, K.S.R. Koteswara Rao   +3 more
doaj  

A Fully Differential CMOS Potentiostat [PDF]

, 2009
A CMOS potentiostat for chemical sensing in a noisy environment is presented. The potentiostat measures bidirectional electrochemical redox currents proportional to the concentration of a chemical down to pico-ampere range.
Genov, Roman, Nazari, Meisam Honarvar
core   +1 more source