Results 111 to 120 of about 12,313 (265)

Multilayered Digital Microfluidic Chip for Cell‐Based Assays

Advanced Materials Interfaces, EarlyView.
A multilayered digital microfluidic (mDMF) chip architecture is introduced to improve throughput and robustness in cell‐based assays. By multilayering electrode components and dielectric layers on glass, this design significantly reduces actuation voltage, maintains reliability, and enables expansion of the operational area with minimum current leakage.
Mert Ozden, Oksana K. Savchak, Burcu Gumuscu   +2 more
wiley   +1 more source

Nonwoven‐Based Textile Architectures for Energy Storage Applications: Materials, Preparation, Characterization, and Prospects

Advanced Materials Interfaces, EarlyView.
Nonwoven textile architectures are emerging as versatile platforms for next‐generation energy storage, demonstrating how tailored materials and fabrication strategies enhance ion transport, conductivity, flexibility, and scalability for high‐performance sustainable devices.
Tarikul Islam, Md. Hanif Munshi, Rijon Saha, Shaikh Almoon Hussain, Aqib Adnan Shafin, Shumsul Arefin, Md. Kamruzzaman   +6 more
wiley   +1 more source

Ambient‐Spray Ni–Cu(–O)/Ag Nanowire Transparent Heaters for High‐Temperature Heating and Far‐/Near‐Field EMI Suppression

Advanced Materials Interfaces, EarlyView.
A vacuum‐free, ambient‐spray Ni–Cu(–O)/Ag nanowire transparent‐heater platform is realized via conformal junction‐shell engineering and silica–hybrid overcoating, enabling robust high‐temperature heating together with GHz‐band far‐field EMI shielding and near‐field magnetic‐noise attenuation.
Ye Na Heo, Do Il Kim, Hyun Ho Park, Soong Ju Oh, Sang Woo Kim   +4 more
wiley   +1 more source

On the Breakdown of Dielectrics (Part III)

The Journal of the Institute of Electrical Engineers of Japan, 1933
TORIYAMA, Y., SHINOHAFA, U.
openaire   +1 more source

Grafted Low‐Leakage Si/AlN p‐n Diodes Enabled by Fluorinated AlN Interface

Advanced Materials Interfaces, EarlyView.
This work demonstrates a fluorination‐based interface engineering strategy that transforms oxygen‐terminated AlN surfaces into fluorine‐terminated interfaces for grafted p‐Si/n‐AlN diodes. By combining pseudo‐ALE oxide removal, XeF2 fluorination, and ultrathin SiNx stabilization, the engineered interface suppresses defect‐assisted reverse leakage by ...
Yi Lu, Tsung‐Han Tsai, Qingxiao Wang, Haicheng Cao, Jie Zhou, You Jin Koo, Chenyu Wang, Yang Liu, Yuyue Hao, Michael Eller, Connor Bailey, Stephanie Liu, Nicholas J. Tanen, Zhiyuan Liu, Mingtao Nong, Robert M. Jacobberger, Tien Khee Ng, Katherine Fountaine, Vincent Gambin, Boon S. Ooi, Xiaohang Li, Zhenqiang Ma   +21 more
wiley   +1 more source

Flexible Wide Bandgap Electrode System for In situ Cell Sensing and Irreversible Electroporation

Advanced Materials Interfaces, EarlyView.
The paper reports the design and wafer‐level microfabrication of a long‐lived, flexible 3C‐SiC electrode capable of sensitive and in situ cell sensing, as well as electroporation ablation. The work demonstrates a biocompatible and durable electrode platform that can perform reliable electrical interfacing with biological tissues over extended periods ...
Minh Anh Huynh, Sharda Yadav, Tuan‐Khoa Nguyen, Nam‐Trung Nguyen   +3 more
wiley   +1 more source

Effect of Molecular Weight and Layer Thickness on the Dielectric Breakdown Strength of Neat and Homopolymer Swollen Lamellar Block Copolymer Films. [PDF]

ACS Appl Polym Mater, 2020
Samant S, Basutkar M, Singh M, Masud A, Grabowski CA, Kisslinger K, Strzalka J, Yuan G, Satija S, Apata I, Raghavan D, Durstock M, Karim A.   +12 more
europepmc   +1 more source

Reconnaissance Peptide Labeling Grain Boundary of Chemically Grown MoS2 Polycrystalline Monolayer

Advanced Materials Technologies, EarlyView.
Self‐assembled peptides on substrates, through adsorption and aggregation, offer an alternative way to label grain boundaries in chemically grown single‐layer polycrystalline MoS2. During an early nucleation step, peptides preferentially bind to grain boundaries.
Linhao Sun, Jinhua Hu
wiley   +1 more source

Solid Particle‐Liquid Metal Mixtures for Robust High‐Current Interconnects in Stretchable Electronics and Soft Robotics

Advanced Materials Technologies, EarlyView.
Metallic microparticles dispersed in liquid metal interconnects mitigate electromigration‐induced failure by reconfiguring internal current density distributions. These fillers facilitate the growth of a robust, protective gallium oxide shell at elevated temperatures, shifting the failure threshold toward a thermal limit.
Ethan J. Krings, Calan Brant, Carson Emeigh, Donovan Vincent Jr., Ravi Tutika, Sangjin Ryu, Eric J. Markvicka   +6 more
wiley   +1 more source

Upcycling Compact Discs Into Ultra‐Stable, Flexible, and Stretchable Nanoporous Gold Electrodes for Enhanced Biosensing Performance

Advanced Materials Technologies, EarlyView.
This article highlights the development of robust and high‐performance flexible and stretchable biosensors that maintain long‐term functionality and optimal electrical conductivity under mechanical deformation, utilizing sustainable and cost‐effective manufacturing principles.
Mousa H. Aldosari, Ahyeon Koh
wiley   +1 more source