Results 211 to 220 of about 67,297 (277)

Photo‐Reconfigurable Supercoupling Induced Transparency in On‐Chip Topological Edge State Cavities

open access: yesAdvanced Materials, Volume 38, Issue 13, 3 March 2026.
A novel supercoupling induced transparency (SIT) is demonstrated in a valley‐Hall photonic crystal. The valley vortices enable the supercoupling between a leaky and a guided topological edge state cavity even across a distance of 4.3 wavelengths, inducing a transparency window with negligible reflection.
Wenhao Wang, Ranjan Singh
wiley   +1 more source

Polyaniline nano-material backed lens antenna for X-band LEO satellite transceivers. [PDF]

open access: yesSci Rep
Abuklill H   +4 more
europepmc   +1 more source

Emergent Freestanding Complex Oxide Membranes for Multifunctional Applications

open access: yesAdvanced Materials, Volume 38, Issue 16, 17 March 2026.
This review surveys freestanding oxide membranes and covers fabrication and three pathways for studies and devices: strain‐free and strained membranes, and van der Waals‐integrated heterostructures. We show how coupled oxide responses map onto these routes and cross‐couple to expand behaviors.
Baowen Li   +6 more
wiley   +1 more source

Unveiling Complementary Unipolar Electrical Transport in ZnO‐Co3O4 Core–Shell Nanowires Exploiting Iontronics

open access: yesAdvanced Materials Technologies, Volume 11, Issue 5, 6 March 2026.
Complementary unipolar electrical transport is demonstrated in ZnO‐Co3O4 core–shell nanowires, by engineering multi‐terminal device architectures that allow to selectively address different sections of the nanostructure and resorting on ionic liquid gating for conformal capacitive coupling and field effect control.
Valeria Demontis   +5 more
wiley   +1 more source

Recyclable and Binder‐Free EGaIn–Carbon Liquid Metal Composite: A Sustainable Approach for High‐Performance Stretchable Electronics, Thermal‐Interfacing and EMI‐Shielding

open access: yesAdvanced Materials Technologies, Volume 11, Issue 6, 18 March 2026.
Binder‐free EGaIn–CB composite deliver printable, recyclable liquid‐metal conductors without sintering or polymer binders. Only 1.5 wt% CB yields shear‐thinning, high‐viscosity rheology, ∼60% bulk EGaIn conductivity, robust stretchability, high thermal conductivity, and strong EMI shielding (35 → 70 dB at 100% strain).
Elahe Parvini   +4 more
wiley   +1 more source

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