Results 191 to 200 of about 131,317 (302)

Unleashing the Potential of Raman Spectroscopy to Estimate PEDOT:PSS Doping Level and Crystalline Morphology

open access: yesAdvanced Science, EarlyView.
Herein, the correlational changes of each PEDOT Raman peak to morphology and doping level are identified. Two equations are derived to estimate PEDOT π–π spacing and doping level from Raman spectra (from which mobility is also extracted). GIWAXS and XPS results validate the estimation equations.
Tzu‐Yi Thomas Yu   +7 more
wiley   +1 more source

Synthesis and Properties of Polyarylene Ether Nitrile and Polyphenylene Sulfone Copolymers. [PDF]

open access: yesPolymers (Basel)
Zhansitov A   +8 more
europepmc   +1 more source

AI‐Directed 3D Printing of Hierarchical Polyurethane Foams

open access: yesAdvanced Science, EarlyView.
Digitally guided direct ink writing, combined with AI‐generated design, enables the fabrication of hierarchical polyurethane foams with tunable multiscale porosity. This approach produces architected foams featuring interconnected open‐cell networks and tailored mechanical properties, advancing the development of adaptive, high‐performance materials ...
Dhanush Patil   +15 more
wiley   +1 more source

Helix Alignment, Chevrons, and Edge Dislocations in Twist‐Bend Ferroelectric Nematics

open access: yesAdvanced Science, EarlyView.
The recently discovered twist‐bend ferroelectric nematic (NTBF) is the new member of the multiferroic family, representing a fluid with an oblique helicoidal (heliconical) periodic structure of spontaneous electric polarization. The work presents a thorough exploration of the material properties of this phase, how the periodic modulation of ...
Bijaya Basnet   +8 more
wiley   +1 more source

A Sustainable Adhesive Paradigm: Reversibly Reinforcing, Heat‐Free Bonding with Universal Substrates

open access: yesAdvanced Science, EarlyView.
A heat‐free adhesive system, delivering superior adhesion strength across metal, plastic, and glass substrates, is developed. Repeatable bonding with reinforcement instead of strength reduction enables error‐tolerant applications. This design paradigm establishes an eco‐friendly alternative to conventional adhesives, particularly suitable for ...
Shuang Zhang   +5 more
wiley   +1 more source

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