Results 211 to 220 of about 11,095,741 (334)

Design of Multiphase Compositionally Complex Alloys for Enhanced Hardness at Elevated Temperatures and Machinability: Comparative Study with Inconel 718

open access: yesAdvanced Engineering Materials, EarlyView.
This study compares the mechanical properties of Inconel 718 with two newly developed compositionally complex alloys (CCAs). Inco‐like‐H alloy demonstrates significantly improved wear resistance, surface finish, and hardness, notably at high temperatures. This CCA requires no heat treatment and is well suited for additive manufacturing. Its performance
Laurent Peltier   +3 more
wiley   +1 more source

Guiding better design and reporting of AI-intervention trials

open access: yesThe Lancet: Digital Health, 2020
The Lancet Digital Health
doaj   +1 more source

Jobseekers' skills and job search behaviour. [PDF]

open access: yesSwiss J Econ Stat
Wunsch C, Rochlitz F, Arni P.
europepmc   +1 more source

IUPUI Open Access Publishing Fund: 2015 Annual Report [PDF]

open access: yes, 2017
Center for Digital Scholarship
core  

Requirements and Evaluation of Commercial Digital Light Processing 3D Printers for Upscaled Production of Microstructured Tissue Culture Devices

open access: yesAdvanced Engineering Materials, EarlyView.
Commercial light‐based 3D printers increasingly find use for industry‐scale production of microstructured tissue culture devices. How can commercial printer performance be assessed for a given application? This work introduces simplified quantitative metrics based on microstructural fidelity analysis, addressing key manufacturing challenges in scaling ...
Zoltán András Guller   +4 more
wiley   +1 more source

Impact of Structural Adhesive Hybridization Strategy on the Performance of In‐Mold Electronics Devices Across Thermoforming and Injection Molding

open access: yesAdvanced Engineering Materials, EarlyView.
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García   +3 more
wiley   +1 more source

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