Geological Lineament Detection, Characterization and Association with Groundwater Contamination in Carbonate Rocks of Musandam Peninsular Using Digital Elevation Model (DEM) [PDF]
Samy Ismail Elmahdy
openalex +1 more source
The accuracy of earthwork calculations that compute terrain volume is critical to digital terrain analysis (DTA). The uncertainties in volume calculations (VCs) based on a DEM are primarily related to three factors: 1) model error (ME), which is caused by an adopted algorithm for a VC model, 2) discrete error (DE), which is usually caused by DEM ...
Li, C, Wang, Q, Shi, W, Zhao, S
openaire +3 more sources
This study explores aerosol jet‐printed (AJP) surface roughness, its effects on the performance of microwave electronics, and its process contributors. First, an electromagnetic model is vetted for AJP's unique roughness signature. Simulations are built which show process‐induced roughness is as significant as conductor resistivity in driving microwave
Christopher Areias, Alkim Akyurtlu
wiley +1 more source
Evaluating Applicability of SRTM DEM (Shuttle Radar Topography Mission Digital Elevation Model) in Hydrologic Analysis: A Case Study of Geum River and Daedong River Areas [PDF]
Younggu Her, Seung‐Hwan Yoo
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A Study on Thermal Expansion and Thermomechanical Behavior of Composite Metal Foams
The coefficient of thermal expansion of steel–steel composite metal foam (S‐S CMF) is shown to be lower than that of bulk stainless steel while its performance under compression demonstrate excellent mechanical stability and strength at all temperatures with gradualsoftening from 400 to 600 °C.
Zubin Chacko+2 more
wiley +1 more source
Determination of 3D Displacements of Drainage Networks Extracted from Digital Elevation Models (DEMs) Using Linear-Based Methods [PDF]
Antonio Tomás Mozas‐Calvache+2 more
openalex +1 more source
Impacts of Device Geometry and Layout on Temperature Profile during Large‐Area Photonic Curing
The study investigates how gate geometry affects peak curing temperature during photonic curing of solution‐processed indium zinc oxide thin‐film transistors. Using 3D simulations and experimental validation, it reveals that larger gate areas and smaller aspect ratios increase curing temperature and thus improve transistor performance. Findings provide
Yasir Fatha Abed+3 more
wiley +1 more source
Shape Memory Polymer‐Based Hook‐and‐Loop Fastener for Robust Bonding and on‐Demand Easy Separation
A 3D shape memory polymer‐based hook‐and‐loop fastener, fabricated using projection microstereolithography and molding, offers tunable bonding strength through temperature control. When heated from 25 to 70 °C, the fastener softens and deforms easily, reducing bonding strength by 20‐fold for on‐demand easy separation.
Chen Yang+5 more
wiley +1 more source
Primary phases and a fatigue crack are studied in a forged blank of an aluminum alloy using synchrotron and laboratory X‐ray computed tomography. To image the crack, the fatigue test is interrupted, and a static tensile load is applied to open the crack.
Jakob Schröder+6 more
wiley +1 more source
Application of the WEPP model with digital geographic information [PDF]
The Water Erosion Prediction Project (WEPP) is a process-based continuous simulation erosion model that can be applied to hillslope profiles and small watersheds. One limitation to application of WEPP (or other models) to the field or farm scale is the
Cochrane, T.A.+2 more
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