Results 181 to 190 of about 124,228 (379)
Digital elevation model (dem) for identification of groundwater prospective zones
Vittala, S. S.+2 more
openaire +3 more sources
A first assessment of the TanDEM-X DEMs over Brazilian territory is presented through a comparison with SRTM, ASTER GDEM and ALOS AW3D30 DEMs in seven study areas with distinct geomorphological contexts, vegetation coverage and land use.
Grohmann, Carlos H.
core +1 more source
Wearable Haptic Feedback Interfaces for Augmenting Human Touch
The wearable haptic feedback interfaces enhance user experience in gaming, social media, biomedical instrumentation, and robotics by generating tactile sensations. This review discusses and categorizes current haptic feedback interfaces into force, thermal, and electrotactile stimulation‐based haptic feedback interfaces, elucidating their current ...
Shubham Patel+3 more
wiley +1 more source
Prioritization of the micro-watersheds through morphometric analysis in the Vasishta Sub Basin of the Vellar River, Tamil Nadu using ASTER Digital Elevation Model (DEM) data. [PDF]
Poongodi R, Venkateswaran S.
europepmc +1 more source
Integration of LIDAR and IFSAR for mapping [PDF]
LiDAR and IfSAR data is now widely used for a number of applications, particularly those needing a digital elevation model. The data is often complementary to other data such as aerial imagery and high resolution satellite data.
Dowman, I.J.
core
The seed pod valves of Australian Banksia attenuata plants are not simply bi‐layers which bend when dry. These experiments and models reveal complex mechanics, which allow seed release only after several steps of seed pod opening. Stiffness gradients prevent delamination of the valves during loading, and a shape‐memory function protects the seeds ...
Friedrich Reppe+7 more
wiley +1 more source
A materials and device design concept that comprises a self‐assembled ultra‐thin epitaxial ion‐transporting layer, an amorphous oxide overcoat oxygen‐blocking layer, and a partial filament formed during an electroforming step is proposed for low‐current multilevel resistive switching devices.
Ming Xiao+17 more
wiley +1 more source