Results 151 to 160 of about 1,296,000 (275)

Evolution of strain field and crack prediction in cemented paste backfill specimens based on digital image correlation and computer vision recognition model. [PDF]

Sci Rep
Zhang H, Gao T, Wang F, Lin Q, Zhang S, Zou C, Yang S, He H.   +7 more
europepmc   +1 more source

Local energy analysis of high-cycle fatigue using digital image correlation and infrared thermography

, 2008
André Chrysochoos, B. Berthel, Félix Latourte, A. Galtier, Stefano Pagano, B. Wattrisse   +5 more
openalex   +2 more sources

Noncontact optical 3D strain measurements in cervical soft tissues biomechanics by digital image correlation under tensile test: an experimental approach. [PDF]

Front Bioeng Biotechnol
Lin F, Cai Y, Li J, Zhan J, Gao Z, Zeng X, Feng M, Li Y, Lin D, Qi J.   +9 more
europepmc   +1 more source

Analysis of FRP-Strengthened Reinforced Concrete Beams Using Electromechanical Impedance Technique and Digital Image Correlation System. [PDF]

Sensors (Basel), 2023
Perera R, Huerta MC, Baena M, Barris C.
europepmc   +1 more source

Extended three-dimensional digital image correlation (X3D-DIC)

, 2008
Julien Réthoré, Jean‐Philippe Tinnes, Stéphane Roux, Jean‐Yves Buffière, François Hild   +4 more
openalex   +2 more sources

Failure Behavior of Nano-Metakaolin Concrete Under Splitting Tension Based on Digital Image Correlation Method. [PDF]

Polymers (Basel)
Chen H, Fan Y, Li Q, Peng C.
europepmc   +1 more source

Application of Digital Image Correlation for Strain Mapping of Structural Elements and Materials. [PDF]

Materials (Basel)
Bogusz P, Krasoń W, Pazur K.
europepmc   +1 more source

704 Measurement of the Strain Field around a Crack Tip in Adhesive Joint using the Digital Image Correlation Method

, 2008
Masahiro Ueda, Nobuyuki SHISHIDO, Tōru IKEDA, Noriyuki MIYAZAKI   +3 more
openalex   +2 more sources

Digital image correlation and infrared thermography data for seven unique geometries of 304L stainless steel. [PDF]

Sci Data
Jones EMC, Reu PL, Kramer SLB, Jones AR, Carroll JD, Karlson KN, Seidl DT, Turner DZ.   +7 more
europepmc   +1 more source

715 Measurement of nonlinear strain in a solder bump in a multilayered PCB under thermal cycles using the digital image correlation method

, 2008
Toshifumi Kanno, Nobuyuki SHISHIDO, Tōru IKEDA, Noriyuki MIYAZAKI, Hiroyuki Tanaka, Takuya HATAO   +5 more
openalex   +2 more sources