Results 261 to 270 of about 1,216,231 (401)

Harnessing Outer Space for Improved Electrocaloric Cooling

open access: yesAdvanced Functional Materials, EarlyView.
A novel radiative heat sink/source‐integrated electrocaloric (R‐iEC) system combines the electrocaloric (EC) effect with a thermally conductive radiative cooler (TCRC) to address heat dissipation limitations in EC devices. Utilizing outer space as a heat sink, the system achieves up to 240 W m−2 of heat dissipation performance, making it highly ...
Dong Hyun Seo   +8 more
wiley   +1 more source

Biobank Digitalization: From Data Acquisition to Efficient Use. [PDF]

open access: yesBiology (Basel)
Bukreeva AS   +7 more
europepmc   +1 more source

Engineered Peptides‐Based Hybrid‐Nested Microneedle Effectively Treat Biofilm‐Infected Diabetic Wounds

open access: yesAdvanced Functional Materials, EarlyView.
A hybrid‐nested microneedle/cryogel scaffold (MQW‐CMg‐MOF) is designed for efficient biofilm removal and accelerated healing of diabetic wounds. The scaffold shows substantial biofilm removal in vitro and in a preclinical diabetic swine biofilm‐infected wound model compared to the control.
Syed Muntazir Andrabi   +11 more
wiley   +1 more source

Mental health apps in India: regulatory landscape and future directions. [PDF]

open access: yesBJPsych Int
Singh Sethi MI   +4 more
europepmc   +1 more source

Light‐Mediated Photomultiplication via Cascade Energy Transfer in Organic Photodiode

open access: yesAdvanced Functional Materials, EarlyView.
Light‐mediated photomultiplication via cascade energy transfer in organic photodiode demonstrates external quantum efficiency exceeding 200% and specific detectivity surpassing 5.0 × 1013 Jones. This advancement effectively addresses the limitation of elevated dark current density characteristic of prior photomultiplication organic photodetectors ...
Gae Hwang Lee   +8 more
wiley   +1 more source

Carbon Nanotube 3D Integrated Circuits: From Design to Applications

open access: yesAdvanced Functional Materials, EarlyView.
As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu   +3 more
wiley   +1 more source

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