Results 161 to 170 of about 29,145 (300)

Synergistic Pyro‐Phototronics and Structural Anisotropy in CsAg2I3/GaN Heterostructures for High‐Performance Polarization‐Sensitive UV Photodetectors

open access: yesAdvanced Science, EarlyView.
The development of polarization‐sensitive ultraviolet photodetectors is limited by poor heterojunction quality and low polarization sensitivity. This study integrates synthesized CsAg2I3 single crystals with intrinsic non‐centrosymmetry into van der Waals heterojunction devices, demonstrating pronounced pyro‐phototronic effect.
Yalin Zhai   +9 more
wiley   +1 more source

Bioinspired Morphology‐Decoupled Soft Gripper with Enhanced Bidirectional Grasping Capability

open access: yesAdvanced Science, EarlyView.
Inspired by biological predation, a novel gripper decouples cross‐modal grasping via dual morphological configurations. Synergistically integrating hybrid rigid and soft coupled fingers with a metamaterial palm, the system performs active compliant grasping for static objects and passive cage capture for dynamic targets.
Yedong Huang   +4 more
wiley   +1 more source

Multiphoton imaging with a direct-diode pumped femtosecond Ti:sapphire laser. [PDF]

open access: yesJ Microsc, 2013
Young MD, Backus S, Durfee C, Squier J.
europepmc   +1 more source

Field‐Driven Activation of Solid‐State Devices in Open Circuits for Energy Harvesting and Wireless Sensing

open access: yesAdvanced Science, EarlyView.
Time‐varying electric fields can activate solid‐state devices such as LEDs and capacitors for energy harvesting and powering in open circuits. The response of solid‐state devices to time‐varying electric fields caused by vibrations can be utilised for smart sensing of human motions and object vibrations.
Renyun Zhang   +6 more
wiley   +1 more source

Silicon‐Embedded Multifunctional Heterogeneous Integration for Miniaturized Photoplethysmography Detection Devices

open access: yesAdvanced Science, EarlyView.
ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen   +7 more
wiley   +1 more source

Suppressed Auger Heating of Hot Carriers in Cu‐Doped Colloidal Quantum Wells

open access: yesAdvanced Science, EarlyView.
ABSTRACT Auger heating represents a major bottleneck for hot carrier (HC) relaxation in colloidal quantum wells (CQWs), delaying carrier accumulation in band‐edge states and diminishing performance in light‐emitting applications. To address this issue, we introduce copper doping in CdSe CQWs to create midgap states, which efficiently suppresses Auger ...
Junhong Yu   +6 more
wiley   +1 more source

Home - About - Disclaimer - Privacy