Results 241 to 250 of about 91,109 (351)
Enhanced cycle stability of a NiCo2S4 nanostructured electrode for supercapacitors fabricated by the alternate-dip-coating method. [PDF]
R Soc Open Sci, 2018 Kang J, Yim S.
europepmc +1 more source
3D Printing of Highly Electrically Conductive Zinc for Sustainable Electronics Applications
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.A 3D printable zinc ink system with active zinc particles in a shellac matrix is demonstrated. The results show high conductivity, stable performance of printed structures under varying humidity conditions, and promising application in disposable water‐activated batteries. This technology combining digital material assembly, reliable operation, and non‐
Xavier Aeby +5 more
wiley +1 more source
Boronate sol-gel method for one-step fabrication of polyvinyl alcohol hydrogel coatings by simple cast- and dip-coating techniques. [PDF]
RSC Adv, 2019 Nishiyabu R +6 more
europepmc +1 more source
Advanced Materials Technologies, EarlyView.This paper explores integrating organic electrochemical transistors (OECTs) with planarized 3D‐printed substrates, utilizing ironing to enhance surface suitability for printing, dispense printing for thick, low‐resistance silver electrodes, and inkjet printing for semiconductor deposition.
Mohamad Kannan Idris +3 more
wiley +1 more source
Advanced Techniques for Scalable Woven E‐Textiles Manufacturing
Advanced Materials Technologies, EarlyView.This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin +2 more
wiley +1 more source
Synthesis and Characterization of Thin TiO2 Films Using the Sol-gel dip Coating Method
, 2020 R. M. Woo-García +6 more
openalex +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Advanced Materials Technologies, EarlyView.Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Polyamide 12/E-glass Fabric Composite Production with Dip-coating
, 2018 Aylin Bekem, Ahmet Ünal
openalex +1 more source
Room Temperature Synthesis and Photopatterning of Mesoporous Titanium Dioxide Thin Films
Advanced Materials Technologies, EarlyView.A nanofabrication strategy combining deep‐UV photolithography with block copolymer self‐assembly enables direct patterning and mineralization of mesoporous TiO2 thin films at room temperature. Photocatalytic titanium oxo‐clusters promote polymer degradation under UV irradiation, enabling multiscale control over porosity, film thickness, and lateral ...
Youssef Ghossoub +5 more
wiley +1 more source