Results 211 to 220 of about 14,160 (254)
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Direct ink writing of tough, stretchable silicone composites
Soft Matter, 2022In this work, we report 3D printable soft composites that are simultaneously stretchable and tough.
Chengyang Mo, Rui Yin, Jordan R. Raney
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Direct ink writing of geopolymeric inks
Journal of the European Ceramic Society, 2017The development of geopolymeric inks with optimized rheological properties for DIW is presented; several inks with different water content and additives were compared to determine which parameters enable extrusion as well as shape retention. It is a challenging task, because the inks are subjected to ongoing poly-condensation reactions which ...
FRANCHIN, GIORGIA +7 more
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Direct ink writing of boron carbide monoliths
Journal of the European Ceramic Society, 2021Abstract Direct ink writing – an extrusion-based additive manufacturing process – followed by pressureless sintering was investigated to produce boron carbide monoliths. The effects of ceramic powder loading and Pluronic binder concentration on the rheology of boron carbide pastes were studied and linked to both processing behaviour and final outcome
Yazid Lakhdar +4 more
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Hierarchical Co‐Assembly Enhanced Direct Ink Writing
Angewandte Chemie International Edition, 2018AbstractIntegrating intelligent molecular systems into 3D printing materials and transforming their molecular functions to the macroscale with controlled superstructures will unleash great potential for the development of smart materials. Compared to macromolecular 3D printing materials, self‐assembled small‐molecule‐based 3D printing materials are ...
Longyu Li +9 more
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Printing direction dependent microstructures in direct ink writing
Additive Manufacturing, 2020Abstract Direct ink writing enables deposition of multiphase filaments with designed microstructures. Using acoustophoresis, we establish a narrow distribution of microparticles at the center of a direct-write nozzle. The distribution shifts and widens after deposition depending on the printing direction. We use particle image velocimetry and digital
Leanne Friedrich, Matthew Begley
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Direct Ink Writing of Rigid Microparticles
SmallAbstractDirect ink writing (DIW) enables 3D printing of macroscopic objects with well‐defined structures and compositions that controllably change over length scales of order 100 µm. Unfortunately, only a limited number of materials can be processed through DIW because it imparts stringent rheological requirements on inks.
Pauline Pradal +4 more
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Multifunctional Reactive Nanocomposites via Direct Ink Writing
Advanced Materials Technologies, 2021Abstract3D printing of reactive materials has, to date, primarily focused on controlling reaction velocities and energy release rates by printing novel architectures, which during reaction typically form gaseous and oxide powder products. The utility of printed reactive materials can be increased by designing the material such that its reaction ...
Shane Q. Arlington +6 more
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Direct ink writing of textured piezoelectric ceramics
The Journal of the Acoustical Society of America, 2023Textured ceramics are often formed via tape casting in order to align platelet particles in the preferred direction, allowing the ceramic to have properties approaching those of single crystals without the complexities of growing such a crystal. However, tape casting produces significant waste material, as flat plates are machined to produce the ...
Chloe Fellabaum +2 more
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Direct ink writing of porous titanium (Ti6Al4V) lattice structures
Materials Science and Engineering: C, 2019Ti6Al4V components, for biomedical and aerospace sectors, are receiving a great interest especially after the advent of additive manufacturing technologies. The most used techniques are Selective Laser Sintering (SLS), Selective Laser Melting (SLM) and Electron Beam Melting (EBM).
Elsayed H. +7 more
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Environmentally stable MXene ink for direct writing flexible electronics
Nanoscale, 2022A long shelf time MXene ink was prepared using a mixture of water and ethylene glycol and is a promising candidate for fabricating conductive circuits and paper-based flexible devices.
Na Kong +7 more
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