Results 261 to 270 of about 6,893,970 (342)

CO Spillover Is Not a Promoter for C─C Bond Formation in CO2 Electroreduction on Cu‐Ag Bimetallic Catalysts

open access: yesAdvanced Science, EarlyView.
CO spillover via the Cu‐Ag interface does not promote C‐C coupling. ABSTRACT Cu‐based bimetallic catalysts have been shown to improve the multi‐carbon (C2+) selectivity in CO2 electroreduction, with the assumption that CO spillover from the CO‐selective catalysts to adjacent Cu domains via their bimetallic interface promotes C–C coupling. Here, through
Beining Xu   +7 more
wiley   +1 more source

Systematically Engineering for Efficient Production of 3‐Methyl‐1‐Butanol in Escherichia coli

open access: yesAdvanced Science, EarlyView.
An integrated metabolic engineering strategy was established for high‐level 3‐methyl‐1‐butanol biosynthesis in Escherichia coli. Molecular dynamics‐guided semi‐rational engineering of dihydroxyacid dehydratase uncovered and relieved key catalytic bottlenecks, while adaptive laboratory evolution enhanced strain robustness.
Nanfei Geng   +6 more
wiley   +1 more source

Enhanced Bandgap Flexibility in Perovskite‐Silicon Tandem Solar Cells via Three‐Terminal Architecture

open access: yesAdvanced Science, EarlyView.
Three‐terminal (3T) perovskite/silicon tandem solar cells overcome the current‐matching constraints of 2T designs. Using an IBC POLO silicon bottom cell, we demonstrate a 30.1% PCE, with performance largely decoupled from perovskite bandgap and enhanced resilience under realistic, time‐dependent solar spectra.
Mohammad Gholipoor   +9 more
wiley   +1 more source

Post-marketing safety profile of dengue vaccines CYD-TDV and TAK-003: analysis of adverse event reports from a European database. [PDF]

open access: yesFront Pharmacol
Gianguzzo VM   +11 more
europepmc   +1 more source

Thermoelectric Property Mapping for High‐Performance Integrated MgAgSb‐MgCuSb System

open access: yesAdvanced Science, EarlyView.
From the property mapping of the MgAgSb–MgCuSb system, both thermoelectric materials and corresponding interface materials are optimized: Ag‐rich compositions provide higher PF and zT, whereas Cu‐rich side yields superior transport properties and low contact resistance.
Jiankang Li   +5 more
wiley   +1 more source

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