Results 161 to 170 of about 166,282,209 (237)

On the Error Metrics Used for Direction of Arrival Estimation. [PDF]

Sensors (Basel)
Hannan MA, Crisafulli O, Giammello G, Sorbello G.   +3 more
europepmc   +1 more source

Effect of Cu and CuP Additions on the Microstructure and Nanoindentation‐Based Fracture Behavior of CoNiAlSi Ferromagnetic Shape Memory Alloys

Advanced Engineering Materials, EarlyView.
Cu and combined Cu–P microalloying refine the microstructure and enhance the nanoindentation‐derived fracture resistance of CoNiAlSi ferromagnetic shape memory alloys without suppressing the martensitic transformation. Comparative SEM, DSC, and nanoindentation results reveal that the CuP‐containing alloy provides the most balanced response, achieving ...
Mehmet Demir
wiley   +1 more source

Cryogenic Deformation Behavior of TiAl and Insights Into Embrittlement After High‐Temperature Exposure Combined With Secondary Ion Mass Spectroscopy of Near Surface Chemistry

Advanced Engineering Materials, EarlyView.
Near‐surface deuterium enrichment profiles for different microstructural types of TiAl after exposure at 700 °C in a heavy water‐containing environment. The deuterium levels are significantly higher than expected from natural occurrence, indicating that the heavy water dissociated during the exposure treatment and entered the specimens.
Jonathan D. H. Paul, Alexander Welle, Dirk Matthiessen, Michael Oehring, Fritz Appel, Florian Pyczak   +5 more
wiley   +1 more source

An Enhanced Smoothed L₀-Norm Direction of Arrival Estimation Method Using Covariance Matrix. [PDF]

Sensors (Basel), 2021
Paik JW, Lee JH, Hong W.
europepmc   +1 more source

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source

Rotary 3D Printing With Integrated Electroplating

Advanced Engineering Materials, EarlyView.
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria, Nicola Larovere, Moslem Mohammadi, Gianluca Percoco, Ali Zolfagharian, Gianni Stano   +5 more
wiley   +1 more source

Outlier-Robust Three-Element Non-Uniform Linear Arrays Design Strategy for Direction of Arrival Estimation in MIMO Radar. [PDF]

Sensors (Basel)
Quirini A, Colone F, Lombardo P.
europepmc   +1 more source

Direction of Arrival Estimation Based on Received Signal Strength Using Two-Row Electronically Steerable Parasitic Array Radiator Antenna. [PDF]

Sensors (Basel), 2022
Rzymowski M, Nyka K, Kulas L.
europepmc   +1 more source

A Multi‐Scale Machine Learning Framework for the Inverse Design of High Entropy Alloys

Advanced Engineering Materials, EarlyView.
High‐entropy alloys offer vast potential for various applications, including electrocatalysis; however, their compositional complexity challenges conventional screening. We introduce an inverse‐design framework combining two neural networks to determine optimal compositions and reconstruct nanoparticle geometry from targeted properties and conventional
Mikael Takoutsin, Marta Campolucci, Nicolas de Andrade Ishiki, Nathan Mirgot, Nadir Zhamantay, Frédéric Kanoufi, Jennifer Peron, Jean Charlety, Emiliano Fonda, Valérie Briois, Marco Faustini, Maria‐Letizia De Marco, Christine Goyhenex, Ovidiu Ersen, Hervé Bulou   +14 more
wiley   +1 more source

Joint Entropy Error Bound of Two-Dimensional Direction-of-Arrival Estimation for L-Shaped Array. [PDF]

Sensors (Basel)
Kong X, Zhao D, Wang N, Xu D.
europepmc   +1 more source