Results 221 to 230 of about 715,075 (267)

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley   +1 more source

Development of Laterally Graded X‐Ray Multilayer Optics

open access: yesAdvanced Materials Technologies, EarlyView.
This work presents the development of laterally graded X‐ray multilayer optics with both constant and variable lateral gradients. By precisely controlling substrate speed profiles and mask design, these multilayers achieve highly accurate lateral gradients and excellent sagittal thickness uniformity, making them ideal for spectroscopy application at ...
Arindam Majhi   +11 more
wiley   +1 more source

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