Microplastics from Wearable Bioelectronic Devices: Sources, Risks, and Sustainable Solutions
Bioelectronic devices (e.g., e‐skins) heavily rely on polymers that at the end of their life cycle will generate microplastics. For research, a holistic approach to viewing the full impact of such devices cannot be overlooked. The potential for devices as sources for microplastics is raised, with mitigation strategies surrounding polysaccharide and ...
Conor S. Boland
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Three-dimensional classification of dislocations from single projections [PDF]
Niermann Tore +2 more
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Effect of Fe/Ni Microalloying on Interface Regulation of SiC/Al Composites: Molecular Dynamics Simulation and Experiments. [PDF]
Song T +5 more
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Discrete slip plane analysis of ferrite microtensile tests: On the influence of dislocation source distribution and non-Schmid effects on slip system activity [PDF]
J. Wijnen +3 more
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Combined Femoral and Sciatic Nerve Palsy Associated with Acetabular Fracture and Dislocation: A Case Report [PDF]
Ki Chul Park +2 more
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A FeN4─O/Clu@NC‐0.1Ac catalyst containing atomically‐dispersed FeN4─O sites (medium‐spin Fe2+) and Fe clusters delivered a half‐wave potential of 0.89 V for ORR and an overpotential of 330 mV at 10 mA cm−2 for OER in 0.1 m KOH. When the catalyst was used in a rechargeable Zn–air battery, a power density of 284.5 mW cm−2 was achieved with excellent ...
Yongfang Zhou +8 more
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Creep-induced microstructural evolution of the eutectic Mo-Si-Ti alloy by correlative electron microscopy [PDF]
Thota Hemanth +6 more
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Surgical treatment of traumatic manubrio-sternal dislocation type I associated with chondrosternal joint rupture. [PDF]
De Pauw V +3 more
europepmc +1 more source
In situ monitoring of bulk photoalignment reveals how molecular weight, azobenzene content, cooling rate, and thickness govern ordering in main‐chain liquid crystalline polymers. Optimized copolymers exceed conventional thickness limits, maintaining stable alignment up to 130 µm with high energy efficiency and reversible optical patterning.
Jaechul Ju +3 more
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